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Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials

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Abstract

Liquid metal-based thermal interface materials (TIMs) have garnered attention in the field of microelectronics due to their flowability and high thermal conductivity. In this study, Composite TIMs were developed using EGa-In-Sn (eutectic gallium-indium-tin) alloy and tungsten particles through a stirred grinding method. The effect of tungsten particle content on the thermal performance of the TIMs was investigated. Finite element analysis was employed to analyze the internal heat transfer behavior. Results demonstrated that the thermal conductivity of the composite TIMs initially increased and then decreased with increasing tungsten particle content, reaching a peak at nearly twice that of EGa-In-Sn alloy. The established two-dimensional model aligned with experimental data, facilitating predictions for the thermal conductivity of composite TIMs. Interconnected tungsten particles formed the primary heat flux channel, while voids impeded the heat flux. Particle spacing, contact mode and void size are the main factors affecting the heat conduction between tungsten particles.

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Funding

This work was supported by the National Natural Science Foundation of China (Grant No. 51971231 and 52105327), Guangxi Natural Science Foundation (Grant No. 2020GXNSFBA297109), Guangxi Science and Technology Program (Grant No. Guike AD20297023), and Science and Technology Plan Project of Yunnan province (Grant No. 202101BC070001-007)

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology of China, Shenyang, 110016, China

    Wendong Wang, Qingsheng Zhu & Jingdong Guo

  2. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    Wendong Wang, Qingsheng Zhu & Jingdong Guo

  3. Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, 541004, China

    Song Wei

  4. College of Material Science and Engineering, Jiangsu University of Sciences and Technology, Zhenjiang, 212001, China

    Xinyu Du, Yanxin Qiao & Xiaojing Wang

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  1. Wendong Wang
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Contributions

Conceptualization: WW, JG; Data curation: WW, XD; Formal analysis: WW, SW; Investigation: WW, XD; Validation: WW; Writing-Original Draft: WW; Writing—Review & Editing: WW, SW, JG; Methodology: SW; Resources: QZ, YQ, XW, JG; Funding acquisition: JG; Project administration: JG; Supervision: JG.

Corresponding authors

Correspondence to Song Wei or Jingdong Guo.

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Wang, W., Wei, S., Du, X. et al. Thermal performance and heat transfer mechanism of EGa-In-Sn/W composite thermal interface materials. J Mater Sci: Mater Electron 35, 1085 (2024). https://doi.org/10.1007/s10854-024-12848-2

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