Low-temperature nickel-doped indium tin oxide anode for flexible organic light-emitting devices Ching-Ming HsuChing-Fong LiuWen-Tuan Wu OriginalPaper Pages: 383 - 387
Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures Dezhi LiChangqing LiuPaul P. Conway OriginalPaper Pages: 388 - 398
The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad Shih-Chang ChangSheng-Chih LinKer-Chang Hsieh OriginalPaper Pages: 399 - 405
Ohmic contact using the Si nano-interlayer for undoped-AlGaN/GaN heterostructures Ho-Young ChaX. ChenL. F. Eastman OriginalPaper Pages: 406 - 410
Influence of pad shape on self-alignment in electronic packaging Do H. AhnJihye LeeYong-Seog Kim OriginalPaper Pages: 411 - 415
Polyol-based phase-change thermal interface materials Yasuhiro AoyagiChia-Ken LeongD. D. L. Chung OriginalPaper Pages: 416 - 424
Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging Qian WangSung-Hoon ChoaChangyoul Moon OriginalPaper Pages: 425 - 432
Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate I. LumM. MayerY. Zhou OriginalPaper Pages: 433 - 442
Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications W. K. ChiangY. C. ChanAndrew Holland OriginalPaper Pages: 443 - 452
Investigation of mid-infrared type-II “W” diode lasers C. L. CanedyW. W. BewleyJ. R. Meyer OriginalPaper Pages: 453 - 461
A carbon nanotube polymer-based composite with high electromagnetic shielding Wern-Shiarng JouHuy-Zu ChengChih-Feng Hsu OriginalPaper Pages: 462 - 470
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads Chih-Chien ChiTung-Han Chuang OriginalPaper Pages: 471 - 478
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Sung K. KangDonovan LeonardJin Yu OriginalPaper Pages: 479 - 485
Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition Szu-Tsung KaoYung-Chi LinJenq-Gong Duh OriginalPaper Pages: 486 - 493
Influence of Ni concentration and Ni3Sn4 nanoparticles on morphology of Sn-Ag-Ni solders by mechanical alloying Hsiang-Yi LeeJenq-Gong Duh OriginalPaper Pages: 494 - 503
Synthesis of novel micro- and mesoporous zeolite nanostructures using electrospinning techniques Duraiswamy SrinivasanRashmi RaoAnis Zribi OriginalPaper Pages: 504 - 509