Ion beam mixing of silicon-germanium thin films Sufian AbedrabboD. -E. ArafahS. Salem Special Issue Paper Pages: 468 - 473
Fluxon pinning in the nodeless pairing state of superconducting YBa2Cu3O7 A. T. FioryD. R. HarshmanJohn D. Dow Special Issue Paper Pages: 474 - 483
Silicon-integrated uncooled infrared detectors: Perspectives on thin films and microstructures V. R. MehtaS. ShetM. P. Lepselter Special Issue Paper Pages: 484 - 490
Novel pulsed-laser-deposition—VO2 thin films for ultrafast applications H. LiuO. VasquezF. E. Fernandez Special Issue Paper Pages: 491 - 496
Analysis of thermal stresses in copper interconnect/low-k dielectric structures Y. -L. Shen Special Issue Paper Pages: 497 - 505
Textural and microstructural transformation of Cu damascene interconnects after annealing Jae-Young ChoHyo-Jong LeeJerzy A. Szpunar Special Issue Paper Pages: 506 - 514
Some silicon-based heterostructures for optical applications M. WillanderQ. X. ZhaoQ. -H. Hu Special Issue Paper Pages: 515 - 521
Modeling and experiments on epitaxially grown multilayers with implications to critical thickness Ganesh VanamuJoshua RobbinsSaleem H. Zaidi Special Issue Paper Pages: 522 - 527
Microstructure and mechanical properties of ceramic/self-assembled monolayer bilayer coatings K. ChitreQ. YangJ. Cho Special Issue Paper Pages: 528 - 533
Toward a better understanding of synthesis and processing of ceramic/self-assembled monolayer bilayer coatings T. O. SalamiQ. YangS. R. J. Oliver Special Issue Paper Pages: 534 - 540
Fabrication of potential NiMoP diffusion barrier/seed layers for Cu interconnects via electroless deposition Y. WuC. C. WanY. Y. Wang Special Issue Paper Pages: 541 - 550
Characterization of environmental stability of pulsed laser deposited oxide ceramic coatings Thad M. AdamsAndrew J. DuncanJames Fitz-Gerald Special Issue Paper Pages: 551 - 558
Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness Jung-Kyu JungNong-Moon HwangYoung-Chang Joo Special Issue Paper Pages: 559 - 563
Progress in crystalline multijunction and thin-film photovoltaics Donna Cowell Senft Special Issue Paper Pages: 571 - 574
Surface modification of ferrous alloys with boron Roumiana S. PetrovaNaruemon Suwattananont Special Issue Paper Pages: 575 - 582
Numerical simulation of thermal wave propagation during laser processing of thin films X. AiB. Q. Li Special Issue Paper Pages: 583 - 591
Formation of Ti diffusion barrier layers in Thin Cu(Ti) alloy films S. TsukimotoT. MoritaMasanori Murakami Special Issue Paper Pages: 592 - 599
Novel interconnection method using electrically conductive paste with fusible filler Jong-Min KimKiyokazu YasudaKozo Fujimoto Special Issue Paper Pages: 600 - 604
Investigation of microstructure and V-defect formation in InxGa1−xN/GaN MQW grown using temperature-gradient metalorganic chemical vapor deposition M. C. JohnsonZ. Liliental-WeberE. D. Bourret-Courchesne Special Issue Paper Pages: 605 - 611
Study of threading dislocations in the plan-view sample of SiGe/Si(001) superlattices by transmission electron microscopy Yusuf Atici Special Issue Paper Pages: 612 - 616
The anomalous microstructural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder Qiang XiaoLuu NguyenWilliam D. Armstrong Special Issue Paper Pages: 617 - 624
Thermal and Mechanical stability of electrically conductive adhesive joints Jun XiaoD. D. L. Chung Special Issue Paper Pages: 625 - 629
Fluxless fabrications of Sn-Au solder microbumps by a hydrogen plasma reflow technique Takao IshiiShinji Aoyama Special Issue Paper Pages: 630 - 634
Oxidation study of pure tin and its alloys via electrochemical reduction analysis Sungil ChoJin YuDa-Yuan Shih Special Issue Paper Pages: 635 - 642
The effects of boron in the Cu(B)/Ti/SiO2 system on the Cu-Ti reaction, resistivity, and diffusion barrier properties H. J. YangS. LeeJ. G. Lee Special Issue Paper Pages: 643 - 646
Encapsulation of lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance Tomohiro IwasakiJeong Hwan KimMunetake Satoh Special Issue Paper Pages: 647 - 654
Molecular beam epitaxial growth and characterization of Cd-based II–VI wide-bandgap compounds on Si substrates G. BrillY. ChenN. K. Dhar Special Issue Paper Pages: 655 - 661
Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization M. N. IslamY. C. Chan Special Issue Paper Pages: 662 - 669
Experimental investigation and thermodynamic calculation of phase equilibria in the Sn-Au-Ni system X. J. LiuM. KinakaK. Ishida Special Issue Paper Pages: 670 - 679