Abstract
The interfacial reaction between Pb-Sn solders and bulk Pd substrate is studied both in the liquid- and solid-state of the solder. The interfacial microstructures are characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope. The correlation between the diffusion path and interfacial microstructure in 62Sn38Pb/Pd, 95Pb5Sn/Pd, and Pb/Pd diffusion couples is demonstrated by means of calculated isothermal sections of the Pb-Sn-Pd system and the metastable phase diagram of the Pb-Pd system.
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References
D.C. Abbott, R.M. Brook, N. McLelland and J.S. Wiley, IEEE Trans. CHMT 14, 567 (1991).
G. Ghosh, to appear in Metall. Mater. Trans. (1998).
J.S. Kirkaldy and L.C. Brown, Can. Met. Quart. 2, 89 (1963).
L.S. Castleman, Metall. Trans. A 12A, 2031 (1981); 14A, 45 (1983).
M.A. Dayananada, Diffusion in Solids: Recent Developments, ed. M.A. Dayananda and G.E. Murch, (Warrendale, PA: TMS, 1985), p. 195.
J.R. Manning, Metall. Trans. 1, 499 (1970).
C.R. Kao, J. Woodford, S. Kim, M.-X. Zhang and Y.A. Chang, Mater. Sci. Eng. A195, 29 (1995).
G. Ghosh, unpublished research, Northwestern University, 1998.
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Ghosh, G. Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium. J. Electron. Mater. 27, 1154–1160 (1998). https://doi.org/10.1007/s11664-998-0064-9
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DOI: https://doi.org/10.1007/s11664-998-0064-9