Abstract
Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a “universal finish” for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
G. Milad, Circuit World 34, 4–7 (2008).
W.C.W. Ng, B.C. Marbella, and I.L.K. Koh, 11th Electronics Packaging Technology Conference, 2009.
L. Leung, http://www.rohmhaas.com/electronicmaterials/interconnect_technical_site/attachments/Tech%20comm_%20Sep%2008%20Lam%20L.%20English.pdf, 2008.
D.E. Walsh, G. Milad, and D. Gudeczauskas, http://www.uyemura.com/library-2.htm#2.
G. Milad, CircuiTree 23, 16 (2010).
G. Milad, http://www.uyemura.com/library-13-final-finishes.htm#13.
G. Milad and D. Gudeczauskas, Met. Finish. 104, 33–36 (2006).
G. Milad and D. Gudeczauskas, http://www.uyemura.com/solder_joint_reliability.htm#5.
IPC. IPC-4556, 2013.
C.-Y. Ho, J.-G. Duh, C.-W. Lin, C.-J. Lin, Y.-H. Wu, H.-C. Hong, and T.-H. Wang, J. Mater. Sci. 48, 2724–2732 (2010).
S.P. Peng, W.H. Wu, C.E. Ho, and Y.M. Huang, J. Alloy Compd. 493, 431–437 (2010).
A. Ourdjini, M.A. Azmah Hanim, I. Siti Rabiatull Aisha, and Y.T. Chin, 33rd International Electronics Manufacturing Technology Conference, 2008.
C.-F. Tseng and J.-G. Duh, Mater. Sci. Eng. A 580, 169–174 (2013).
J.-M. Kim, S.-W. Woo, Y.-S. Chang, Y.-J. Kim, J.-B. Choi, and K.-Y. Ji, Thin Solid Films 517, 4255 (2009).
C.W. Lee, L.Y. Hung, C.C. Chang, Y.P. Wang, and C.S. Hsiao, Microsystems, Packaging, Assembly and Circuits Technology Conference, 3rd International, IMPACT, 2008.
C.H. Fu, L.Y. Hung, D.S. Jiang, Y. P. Wang, and C.S. Hsiao, Microsystems, Packaging, Assembly and Circuits Technology, (IMPACT 2007, International).
C.-H. Fu, L.-Y. Hung, D.-S. Jiang, C.-C. Chang, Y.P. Wang, and C.S. Hsiao, Electronic Components and Technology Conference, 2008.
K. Johal, H. Roberts, and S. Lamprecht, SMTA International Conference, 2004.
Y.W. Lee, J.H. Lee, J.T. Moon, Y.S. Park, and K.W. Paik, 11th Electronics Packaging Technology Conference, 2009.
J. Li, Z. Zhao, and J. Lee, 11th International Conference on Electronic Packaging Technology and High Density Packaging, 2010.
W. Sun, W.H. Zhu, E.S.W. Pho, H.S. Tan, and R.T. Gan, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2008.
D.K.W. Yee, Microsystems, Packaging, Assembly and Circuits Technology, IMPACT 2007.
D. Gudeczauskas, http://www.uyemura.com/library-14-electroless-plating-LTCC-substrates.htm#14.
K. Hasegawa, Y. Ejiri, T. Sakurai, and Y. Tsubomatsu, http://www.ems007.com/pages/zone.cgi?a=71363.
K. Johal, H. Roberts, K. Desai, and R. Huemoeller, SMAT 11th Annual Pan Pacific Microelectronics Symposium, 2006.
Y. Oda, M. Kiso, S. Kurosaka, A. Okada, K. Kitajima, S. Hashimoto, G. Milad, and D. Gudeczauskas, 41st International Symposium Microelectronics (Providence, RI, Nov 2–6, 2008).
K.W. Dennis, S.L. Yee, and L.M. Bayes, Microsystems, Packaging, Assembly and Circuits Technology Conference, 4th International IMPACT 2009.
Y. Oda, K. Masayuki, S. Hashimoto, G. Milad, and D. Gudeczauskas, IMAPS 2007.
D.W. Kim, J.K.J. Lee, M.J. Lee, S.Y. Pai, S. Chen, and F. Kuo, Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010.
C.T. Lu, H.W. Tseng, C.H. Chang, T.S. Huang, and C.Y. Liu, Appl. Phys. Lett. 96, 232103 (2010).
L. Nicholls, R. Darveaux, A. Syed, S. Loo, T.Y. Tee, T.A. Wassick, and B. Batchelor, Electronic Components and Technology Conference, 2009.
J.-M. Kim, H.-B. Lee, Y.-S. Chang, J.-B. Choi, Y.-J. Kim, and K.-Y. Ji, Proceedings of the 2nd International Symposium on Computational Mechanics and the 12th International Conference on the Enhancement and Promotion of Computational Methods in Engineering and Science, 2010.
J.-B. Lee, J.-G. Lee, and S.-B. Jung, Proc. Symp. Ultrason. Electron. 30, 287–288 (2009).
A. Bahl, Sierra Circuits, 2010.
J. Fellman, Proceedings of the International Conference on Lead-free Soldering (Toronto, ON, Canada, 2006).
Y.-D. Jeon, Y.-B. Lee, and Y.-S. Choi, Electronic Components and Technology Conference, 2006.
K. Johal, S. Lamprecht, and H. Roberts, 9th Annual SMTA Pan Pacific Microelectronics Symposium, 2004.
K. Johal, H. Roberts, T. Beck, S. Lamprecht, H.-J. Schreier, and C. Sebald, SMAT 12th Annual Pan Pacific Microelectronics Symposium, 2007.
H. Roberts, S. Lamprecht, C. Sebald, M. Bachman, J. Osenbach, K. Desai, R. Huemoeller, Y.H. Jung, and R. Davreaux, http://www.atotech.com/fileadmin/pdf/papers/el/Performance_Evaluations_of_ENEPIG.pdf.
W.H. Wu, C.S. Lin, S.H. Huang, and C.E. Ho, J. Electron. Mater. 39, 2387–2396 (2010).
D.K.W. Yee, TPCA Conference, 2006.
G. Milad and M. Orduz, Met. Finish. 105, 25–28 (2007).
Y.J. Chen, K.Y. Huang, H.T. Chen, and C.R. Kao, IEEE International Symposium on Advanced Packaging Materials, 2013, pp. 102–112.
T.-K. Lee, B. Zhou, T.R. Bieler, C.-F. Tseng, and J.-G. Doh, J. Electron. Mater. 42, 215–223 (2013).
D. Cavasin, Electronic Components and Technology Conference, 2010.
K. Hasegawa, A. Takahashi, T. Noudou, and A. Nakaso, Plat. Surf. Finish. 91, 20–25 (2004).
Petar Ratchev, Serguei Stoukatch, and Bart Swinnen, Microelectron. Reliab. 46, 1315–1325 (2006).
K. Yoshikawa, T. Shibata, M. Kiso, S. Hashimoto, and D. Gudeczauskas, http://www.uyemura.com/library-6.htm#6.
S.L. Ngoh, W. Zhou, H.L. Pang, A.C. Spowage, and J. Li, Proceeding of 7th Electronics Packaging Technology Conference, 2005.
H. Roberts, S. Lamprecht, C. Sebald, M. Bachman, J. Osenbach, K. Desai, R. Huemoeller, Y.H. Jung, and R. Davreaux,
Acknowledgements
The authors would like to thank the more than 100 companies and organizations that support research activities at the Center for Advanced Life Cycle Engineering at the University of Maryland annually.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Ratzker, M., Pearl, A., Osterman, M. et al. Review of Capabilities of the ENEPIG Surface Finish. J. Electron. Mater. 43, 3885–3897 (2014). https://doi.org/10.1007/s11664-014-3322-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-014-3322-z