Abstract
Ni diffusion in Cu6Sn5 intermetallic compound was investigated. First, we successfully fabricated preferred-orientation Cu6Sn5 crystal by liquid-phase electroepitaxy (LPEE). Then, Ni/Cu6Sn5 diffusion couples were produced by sputtering from a Ni thin film onto the Cu6Sn5 crystal. Ni/Cu6Sn5 diffusion couples were annealed at different temperatures of 120°C, 160°C, 200°C, 255°C, 290°C, and 320°C for 2 h in a vacuum. The Ni atomic profile across the Ni/Cu6Sn5 interface was obtained by electron spectroscopy for chemical analysis (ESCA). From the Ni atomic profiles, the Matano method was used to evaluate the Ni interdiffusion coefficients (\( \tilde{D}_{\rm{Ni}} \)) in the Cu6Sn5 crystal obtained with different annealing temperatures, which then yields the activation energy for Ni diffusion in the Cu6Sn5 crystal at a particular Ni content. We found that, as Ni diffuses in the ternary Cu6−x Ni x Sn5 compound phase, the activation energy of Ni interdiffusion decreases with the Ni content.
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Huang, KC., Shieu, FS., Hsiao, Y.H. et al. Ni Interdiffusion Coefficient and Activation Energy in Cu6Sn5 . J. Electron. Mater. 41, 172–175 (2012). https://doi.org/10.1007/s11664-011-1821-8
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DOI: https://doi.org/10.1007/s11664-011-1821-8