Abstract
The thermal, mechanical, and dielectric properties of new high-performance polyphenylene sulfide/aluminum nitride (AlN) composites prepared by hot pressing were investigated for use in electronic packaging. The coefficient of thermal expansion was decreased by 41%. The glass-transition temperature and Vickers microhardness were increased by 13°C and 46%, respectively, for the 15.1 vol.% AlN composite. A modified rule of mixtures with β of 0.065 fits the data. The dielectric constant and loss factor of the composites are within the range of requirements for commercial use.
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References
R.K. Goyal, A.N. Tiwari, U.P. Mulik, and Y.S. Negi, Compos. Sci. Technol. 67, 1802 (2007).
C.P. Wong and S.B. Raja, J. Appl. Polym. Sci. 74, 3396 (1999).
M. Chaturvedi and Y.-L. Shen, Acta Mater. 46, 4287 (1998).
W. Kim, J.-W. Bae, I.-D. Choi, and Y.-S. Kim, Polym. Eng. Sci. 39, 756 (1999).
T.J. Wooster, S. Abrol, J.M. Hey, and D.R. MacFarlane, Composites A 35, 75 (2004).
H. Ishida and S. Rimdusit, Thermochem. Acta 320, 177 (1998).
L. Li and D.D.L. Chung, J. Electron. Mater. 23, 557 (1994).
K.E. Gonsalves, X. Chen, and M.-I. Baraton, Nanostruct. Mater. 9, 181 (1997).
W.C.-Y. Yui, C.W. Chen, Y.Z. Wu, and Y.-C. Chen, Electrochem. Solid State Lett. 8, F1 (2005).
J. Gu, Q. Zhang, J. Dang, J. Zhang, and Z. Yang, Polym. Eng. Sci. 49, 1030 (2009).
Electronic Materials Handbook, Packaging, vol. 1 (Materials Park: ASM International Handbook Committee, 1998).
M. Iji and Y. Kiuchi, J. Mater. Sci.: Mater. Electron. 15, 175 (2004).
Datasheet of Polyclad Laminates, Inc. www.becker-mueller.de, 2004.
Datasheet of Sanmina-SCI Corp. www.sanmina-sci.com, 2005
N.C. Frederic, ed., Thermoplastic Aromatic Polymer Composites (Oxford: Butterworth Heinemann Ltd., 1992).
R.K. Goyal (Ph.D. thesis, Indian Institute of Technology Bombay, Mumbai, 2007).
J. Mark, ed., Polymer Data Handbook (London: Oxford University Press, 1999).
S. Yu, W.M. Wong, Y.K. Juay, and M.S. Yong, SIMTech Technical Rep. 8, 71 (2007).
J. Yang, T. Xu, A. Lu, Q. Zhang, H. Tan, and Q. Fu, Compos. Sci. Technol. 69, 147 (2009).
Y.F. Zhao, M. Xiao, S.J. Wang, X.C. Ge, and Y.Z. Meng, Compos. Sci. Technol. 67, 2528 (2007).
R.K. Goyal, S.D. Samant, A.K. Thakar, and A. Kadam, J. Phys. D 43, 365404 (2010).
X. Wang, W. Tong, W. Li, H. Huang, J. Yang, and G. Li, Polym. Bull. 57, 953 (2006).
H. Zou, W. Xu, Q. Zhang, and Q. Fu, J. Appl. Polym. Sci. 99, 1724 (2006).
Z. Jiang, L.A. Gyurova, A.K. Schlarb, K. Friedrich, and Z. Zhang, Compos. Sci. Technol. 68, 734 (2008).
M.H. Cho, S. Bahadur, and A.K. Pogosian, Wear 258, 1825 (2005).
S. Bahadur and C. Sunkara, Wear 258, 1411 (2005).
L.M. Sheppard, Ceram. Bull. 69, 1801 (1990).
L. Priya and J.P. Jog, J. Polym. Sci. B 40, 1682 (2002).
R.K. Goyal, A.N. Tiwari, and Y.S. Negi, Mater. Sci. Eng. A 491, 230 (2008).
T.H. Farebrother and J.A. Raymond, Polymer Engineering Composites, ed. M.O.W. Richardson (London: Applied Science, 1977), pp. 197–235.
G. Tsagaropoulos and A. Eisenberg, Macromolecules 28, 6067 (1995).
R.K. Goyal, A.N. Tiwari, U.P. Mulik, and Y.S. Negi, J. Phys. D 41, 085403 (2008).
R.T. Rao, J.R. Eugene, and G.K. Alan, Microelectronics Packaging Handbook, Technology Drivers, Part I, 2nd ed. (London: Chapman and Hall, 1997).
S.-F. Wang, Y.-R. Wang, K.-C. Cheng, J.-H. Chen, and Y.-P. Hsaio, J. Electron. Mater. 37, 925 (2008).
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Goyal, R.K., Jadhav, P. & Tiwari, A.N. Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging. J. Electron. Mater. 40, 1377–1383 (2011). https://doi.org/10.1007/s11664-011-1520-5
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DOI: https://doi.org/10.1007/s11664-011-1520-5