Abstract
Nonmagnetic Ni(V) metal and low consumption rate with solders are the advantages of sputtered Ti/Ni(V)/Cu under bump metallization (UBM). However, a Sn-rich phase (“Sn-patch” herein) can form in the Ni(V) layer after reflow and aging. In lead-free solder, Sn-patches form and grow more quickly than in Sn-Pb solder. Thus, the effect of Sn-patches on solder joint reliability becomes critical. In this study, Sn-3.0Ag-0.5Cu solder was reflowed with Ti/Ni(V)/Cu UBM at 250°C for 60 s, and then aged at 150°C for various durations. A high-speed impact test was introduced to evaluate solder joint reliability. After impact testing, it was found that, the larger the Sn-patch, the greater the propensity of the solder joint to suffer brittle fracture. The correlation between Sn-patch and solder joint reliability is discussed.
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References
P.A. Totta and R.P. Sopher, IBM J. Res. Dev. 13, 226 (1969).
J.H. Lau, Flip Chip Technologies (New York: McGraw-Hill, 1996), p. 123.
C.H. Tung, P.S. Teo, and C. Lee, IEEE Trans. Dev. Mater. Reliab. 5, 212 (2005).
M. Li, F. Zhang, W.T. Chen, K. Zeng, K.N. Tu, H. Balkan, and P. Elenius, J. Mater. Res. 17, 1612 (2002).
F. Zhang, M. Li, C.C. Chum, and K.N. Tu, J. Mater. Res. 17, 2757 (2002).
F. Zhang, M. Li, C.C. Chum, and C.-H. Tung, J. Mater. Res. 18, 1333 (2003).
C.Y. Liu, K.N. Tu, T.T. Sheng, C.H. Tung, D.R. Frear, and P. Elenius, J. Appl. Phys. 87, 750 (2000).
A.T. Wu and F. Hua, J. Mater. Res. 22, 735 (2007).
G.Y. Jang, J.G. Duh, H. Takahashi, S.W. Lu, and J.C. Chen, J. Electron. Mater. 35, 1745 (2006).
G.Y. Jang and J.G. Duh, J. Electron. Mater. 35, 2061 (2006).
K.J. Wang, Y.Z. Tsai, J.G. Duh, and T.Y. Shih, J. Mater. Res. 24, 2638 (2009).
F. Zhang, M. Li, B. Balakrisnan, and W.T. Chen, J. Electron. Mater. 31, 1256 (2002).
K.J. Wang and J.G. Duh, J. Electron. Mater. 38, 2534 (2009).
F. Song, S.W.R. Lee, K. Newman, B. Sykes, and S. Clark, Electronic Components and Technology Conference (2007), p. 364.
S.W. Chen and C.C. Chen, J. Electron. Mater. 36, 1121 (2007).
T. Morita, R. Kajiwara, I. Ueno, and S. Okabe, Jpn. J. Appl. Phys. 47, 6566 (2008).
Y.C. Lin, T.Y. Shih, S.K. Tien, and J.G. Duh, J. Electron. Mater. 36, 1469 (2007).
Y.C. Lin, T.Y. Shih, S.K. Tien, and J.G. Duh, Scripta Mater. 56, 49 (2007).
Y.C. Sohn, J. Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee, J. Mater. Res. 19, 2428 (2004).
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Wang, KJ., Duh, JG., Sykes, B. et al. Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C. J. Electron. Mater. 39, 2558–2563 (2010). https://doi.org/10.1007/s11664-010-1370-6
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DOI: https://doi.org/10.1007/s11664-010-1370-6