Abstract
The results of an intensive reliability study on Pb-free ball grid array (BGA)/Sn-Pb solder assemblies as well as some lessons learnt dealing with mixed assembly production at Celestica are described in this paper. In the reliability study, four types of Pb-free ball grid array components were assembled on test vehicles using the Sn-Pb eutectic solder and typical Sn-Pb reflow profiles with 205°C to 220°C peak temperatures. Accelerated thermal cycling (ATC) was conducted at 0°C to 100°C. The influence of the microstructure on Weibull plot parameters and the failure mode will be shown. Interconnect defects such as nonuniform phase distribution, low-melting structure accumulation, and void formation are discussed. Recommendations on mixed assembly and rework parameters are given.
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Acknowledgements
The authors would like to thank the following individuals from Celestica, Toronto: Blake Harper for statistical analysis and Thilo Sack for technical discussions and paper review. The authors thank the Celestica Thailand Lab for the rework analysis and images.
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Snugovsky, P., McCormick, H., Bagheri, S. et al. Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies. J. Electron. Mater. 38, 292–302 (2009). https://doi.org/10.1007/s11664-008-0592-3
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DOI: https://doi.org/10.1007/s11664-008-0592-3