The interfacial reaction between a eutectic Sn-3.5wt.%Ag solder and an electroless nickel–immersion gold-plated Cu substrate during reflow was examined by transmission electron microscopy (TEM). During the initial reflowing, the amorphous, electroless Ni (P)-plated layer crystallized into two P-rich Ni layers: a Ni12P5 + Ni3P mixed upper layer and a Ni3P lower layer. No ternary Ni-Sn-P layer was observed in the initial stage. After subsequent reflow for 60 s, a ternary Ni2SnP layer (containing a small amount of the Ni3P phase) was formed between the Ni3Sn4 and P-rich Ni layers (Ni3P + Ni12P5 + Ni).
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ACKNOWLEDGEMENTS
This work was supported by Grant No. RTI04-03-04 from the Regional Technology Innovation Program of the Ministry of Commerce, Industry and Energy (MOCIE) and, in part, by a grant from the␣Korea Science and Engineering Foundation (KOSEF) through the Center for Nanotubes and Nanostructured Composites (CNNC).
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Kang, HB., Bae, JH., Lee, JW. et al. Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates. J. Electron. Mater. 37, 84–89 (2008). https://doi.org/10.1007/s11664-007-0262-x
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DOI: https://doi.org/10.1007/s11664-007-0262-x