Abstract
Effects of Cu doping on the microstructural evolution in the eutectic SnBi solder stripes under annealing and current stressing were investigated. Coarsening of the Bi grains was observed in the eutectic SnBi solder upon annealing at 85°C. Doping of 1 wt.% Cu could significantly reduce the grain coarsening rate from 2.8 to 0.5 μm3/h. In addition to grain coarsening, mass accumulation of Bi at the anode and solder depletion at the cathode of the eutectic SnBi solder stripe stressed by a current of 1.3 × 104 A/cm2 at 85°C were also observed. Doping of 1 wt.% Cu could also reduce the grain coarsening of the solder under current stressing; however, it resulted in an enhancement of the electromigration effect. Accumulation of Bi at the anode and the solder depletion at the cathode became more severe in the Cu-doped solder stripe.
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Acknowledgement
The authors wish to acknowledge the financial support of National Science Council of Taiwan, ROC through Grant NSC 94-2214-E-005-008.
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Chen, CM., Huang, CC., Liao, CN. et al. Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing. J. Electron. Mater. 36, 760–765 (2007). https://doi.org/10.1007/s11664-007-0150-4
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DOI: https://doi.org/10.1007/s11664-007-0150-4