Abstract
This study investigated microstructure thermal behavior, and mechanical properties of Sn-3.3Ag-0.5Cu alloys (SAC) with the addition of transition metals (TM, Ni, Co, and Zn). Results show that alloying with TM elements was able to reduce the degree of undercooling and strengthen SAC alloys. Among these elements, only Zn can raise the ductility. CoSn and Cu-Ni-Sn intermetallics appeared, respectively, in the Co-containing and Ni-containing samples while coarse Sn dendrites and a large area of eutectic phases could be observed in the specimens with Zn. These microstructural changes led to an inferior vibration fracture resistance under resonant vibration with a constant pull force.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
I.E. Anderson, B.A. Cook, J. Harringa, and R.L. Terpstra, JOM 54(6), 26 (2002).
G.S. Wable, S. Chada, B. Neal, and R.A. Fournelle, JOM 57(6), 38 (2005).
D.W. Henderson, T. Gosselin, A. Sarkhel, S.K. Kang, W.K. Choi, D.Y. Shih, C. Goldsmith, and K.J. Puttlitz, J. Mater. Res. 17, 2775 (2002).
D.R. Frear, J.W. Jang, J.K. Lin, and C. Zang, JOM 53 (6), 28 (2001).
J. Zhao, L. Qi, X.M. Wang, and L. Wang, J. Alloys Compd. 375, 196 (2004).
P.T. Vianco and J.A. Rejent, J. Electron. Mater. 28, 1127 (1999).
A. Sharif, and Y.C. Chan, Thin Solid Films 504, 431 (2006).
Z.G. Chen, Y.W. Shi, Z.D. Xia, and Y.F. Yan, J. Electron. Mater. 31, 1122 (2002).
C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang, J. Mater. Res. 17, 3146 (2002).
B.L. Chen and G.Y. Li, Thin Solid Films 462–463, 395 (2004).
I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra, and O. Unal, J. Electron. Mater. 30, 1050 (2001).
I.E. Anderson, B.A. Cook, J. Harringa, and R.L. Terpstra, J. Electron. Mater. 31, 1166 (2002).
Y. Kariya, T. Hoso, T. Kimura, and S. Terashima, The Inter Society Conference on Thermal Phenomena (Piscataway, NJ: IEEE, 2004), pp. 103–108.
C.M. Chuang, and K.L. Lin, J. Electron. Mater. 32, 1426 (2003).
C.M. Chuang, P.C. Shih, and K.L. Lin, J. Electron. Mater. 33, 1 (2004).
K.S. Kim, S.H. Huh, and K. Suganuma, Microelectron. Reliab. 43, 259 (2003).
S.K. Kang, D.Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S. Cho, J. Yu, and W.K. Choi, JOM 56(6), 34 (2004).
S.K. Kang, D. Leonard, D.Y. Shih, L. Gignac, D.W. Henderson, S. Cho, and J. Yu, J. Electron. Mater. 35, 479 (2006).
D.J. Lee, D.H. Baek, K.K. Lee, K.M. Lee, and Y.J. Seo, Z. Metallkd. 96, 148 (2005).
Q.J. Yang, H.L.J. Pang, Z.P. Wang, G.H. Lim, F.F. Yap, and R.M. Lin, Microelectron. Reliab. 40, 1097 (2000).
Y.B. Kim, H. Noguchi, and M. Amagai, Microelectron. Reliab., 46, 459 (2006).
R.F. Steidel, Jr., An Introduction to Mechanical Vibrations, 3rd ed. (Hoboken, NJ: John Wiley & Sons, 1989), p. 169.
L. Liu, C. Andersson, and J. Liu, J. Electron. Mater. 33, 935 (2004).
J.M. Song, G.F. Lan, T.S. Liu, and L.H. Chen, J. Alloys Compd. 379, 233 (2004).
J.M. Song, F.I. Li, T.S. Liu, and L.H. Chen, J. Mater. Res. 19, 2665 (2004).
A.U. Telang, T.R. Bieler, S. Choi, and K.N. Subramanian, J. Mater. Res. 17, 2294 (2002).
A.U. Telang, T.R. Bieler, J.P. Lucas, K.N. Subramanian, L.P. Lehman, Y. Xing, and E.J. Cotts, J. Electron. Mater. 33, 1412 (2004).
L.P. Lehman et al., J. Electron. Mater. 33, 1429 (2004).
A. LaLonde, D. Emelander, J. Jeannette, C. Larson, W. Rietz, D. Swenson, and D.W. Henderson, J. Electron. Mater. 33, 1545 (2004).
C.M. Chuang, T.S. Lui, L.H. Chen, and T.M. Yin, Mater. Trans. 42, 2064 (2001).
J.S. Koehler, Plastic Deformation in Crystallines Solids (Pittsburgh, PA: Mellon Institute, 1950), p. 216.
A. Granato and K. Lücke, J. Appl. Phys. 27, 583 (1956).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Song, JM., Huang, CF. & Chuang, HY. Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys. J. Electron. Mater. 35, 2154–2163 (2006). https://doi.org/10.1007/s11664-006-0326-3
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-006-0326-3