Abstract
Intermetallic compounds (IMCs) are formed as a result of interaction between solder and metallization to form joints in electronic packaging. These joints provide mechanical and electrical contacts between components. The knowledge of fracture strength of the IMCs will facilitate predicting the overall joint property, as it is more disposed to failure at the joint compared to the solder because of its brittle characteristics. The salient feature of this paper is the measurement of the fracture toughness and the critical energy-release rate of Cu3Sn and Cu6Sn5 intermetallic thin films, which is the result of the interaction between Sn from the solder and Cu from the metallization. To achieve the objective, a controlled buckling test was used. A buckling test in the current work refers to one that displays large transverse displacement caused by axial compressive loading on a slender beam. The stress and strain along the beam can be easily calculated by the applied displacement. Fracture-toughness values of Cu3Sn and Cu6Sn5 are 2.85 MPa √m ± 0.17 MPa √m and 2.36 MPa √m ± 0.15 MPa √m, respectively. Corresponding critical energy-release rate values are 65.5 J/m2 ± 8.0 J/m2 and 55.9 J/m2 ± 7.3 J/m2, respectively. The values obtained were much higher than the ones measured in bulk intermetallic samples but correlated well with those values obtained from conventional fracture-toughness specimens when fracture was confined within the intermetallic layers. Hence, the controlled buckling test is a promising fast and effective way to elucidate mechanical properties of thin films.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
N.S. Stoloff, C.T. Liu, and S.C. Deevi, Intermetallics 8, 1313 (2000).
R.W. Cahn, Intermetallics 6, 563 (1998).
J.K. Kim, M.S. Suk, and H.Y. Kwon, Surf. Coating Technol. 82, 23 (1996).
R.E. Pratt, E.I. Stromwold, and D.J. Quesnal, J. Electron. Mater. 23, 375 (1994).
J. Sigelko, S. Choi, K.N. Subramanian, J.P. Lucas, and T.R. Bieler, J. Electron. Mater. 28, 1184 (1999).
Y.C. Chan, A.C.K. So, and J.K.L. Lai, Mater. Sci. Eng. B 55, 5 (1998).
R.J. Fields, S.R. Low III, and G.K. Lucey, Jr., The Metal Science of Joining, ed. M.J. Cieslak, J.H. Perepezko, S. Kang, and M.E. Glicksman (Warrendale, PA: TMS, 1992), pp. 165–173.
K. Nakajima, A. Isogai, and Y. Taga, Jpn. J. Appl. Phys. Suppl. 2, 309 (1974).
R.P. Vinci and J.J. Vlassak, Ann. Rev. Mater. Sci. 26, 432 (1996).
D.S. Campbell, Handbook of Thin Film Technology, ed. L.I. Maissel and R. Glang (New York: McGraw-Hill, 1971).
A.J. Griffin, F.R. Brotzen, and C.F. Dunn, Thin Solid Films 220, 265 (1992).
F.R. Brotzen, Int. Mater. Rev. 39, 24 (1994).
K. Hashimoto, M. Sakane, M. Ohnami, and T. Yoshida, J. Soc. Mater. Sci. Jpn. 43, 703 (1994).
W.N. Sharpe, Jr., B. Yuan, and R.L. Edwards, J. Mircomech. Sys. 6, 193 (1997).
O.R. Shojaei and A. Karimi, Thin Solid Films 332, 202 (1998).
L. Gan, B.B. Nissan, and A.B. David, Thin Solid Films 290, 362 (1996).
V. Navratil and V. Stejskalova, Phys. Status Solidi, A157, 345 (1996).
W.D. Nix, Mater. Sci. Eng. A234, 37 (1997).
S. Makarov, E. Chilla, and H.J. Frohlich, IEEE 1995, Ultrasonics Symp. Proc. (Piscataway, NJ: IEEE, 1995), pp. 357–360.
K.N. Tu, Mater. Chem. Phys. 46, 217 (1996).
J.W. Hutchinson, Mechanics of Thin Films and Multilayers (Lyngby, Denmark: Technical University of Denmark, 1996).
Z. Chen, B. Cotterell, W. Wang, E. Guenther, and S.J. Chua, Thin Solid Films 394, 202 (2001).
S.J. Britvec, The Stability of Elastic Systems (New York: Pergamon Press, 1973).
J.H. Westbrook and R.L. Fleischer, eds., Structural Applications of Intermetallic Compounds (New York: Wiley, 2000).
B. Cotterell and Z. Chen, Int. J. Fract. 104, 169 (2000).
J.W. Hutchinson and Z. Suo, Adv. Appl. Mech. 29, 63 (1992).
K.S. Siow and M. Manoharan, Proc. 1st IPC/SMTA Electronics Assembly Expo (Providence, RI: Institute PC and Surface Mount Technology Association, 1998), pp. S19-3-1–S19-3-8.
D.R. Frear and P.T. Vianco, Metall. Mater. Trans. A 25A, 1509 (1994).
R.E. Pratt and D.J. Quesnel, The Metal Science of Joining, ed. M.J. Cielak, J.H. Perepezko, and M.E. Glicksman (Warrendale, PA: TMS, 1992), pp. 201–210.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Balakrisnan, B., Chum, C.C., Li, M. et al. Fracture toughness of Cu-Sn intermetallic thin films. J. Electron. Mater. 32, 166–171 (2003). https://doi.org/10.1007/s11664-003-0188-x
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-003-0188-x