Abstract
Intermetallic phases and microstructures formed between In solder and Au/Ni/Ti thin films during reflow were characterized using x-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Two types of two-step heat treatment were performed in a rapid thermal annealing (RTA) system or in a furnace to simulate the flip-chip solder-joining process. The AuIn2 and In27Ni10 intermetallic phases were observed after the two-step heat treatment at the lower temperature. Additional In-Ni intermetallic layers formed between the In27Ni10 and Ni layer, which was two-step heat treated at the higher temperature. This phase was identified as metastable InNi of CsCl type with a=∼3.1 Å by convergent-beam electron diffraction (CBED).
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Shin, K., Cho, WG. & Kim, YH. Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process. J. Electron. Mater. 32, 483–491 (2003). https://doi.org/10.1007/s11664-003-0130-2
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DOI: https://doi.org/10.1007/s11664-003-0130-2