Abstract
As an alternative to the time-consuming solder pastes and preforms currently being used, a method of electroplating the eutectic Au/Sn alloy has been developed. Using a pulsed co-deposition process, it is possible to plate the solder directly onto a wafer at or near the eutectic composition from a single solution. It has been shown that two distinct phase, Au5Sn and AuSn, can be deposited separately over a range of current densities at compositions of 15 at. %Sn and 50 at. %Sn, respectively. by adjusting the deposition current pulse, it is possible to plate both phases in a layered composite thereby achieving any desired composition between 15 and 50 at. %Sn, including the commercially important eutectic composition.
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References
W. Plumbridge, J. Mater. Sci. 31, 2501 (1996).
G. Matijasevic, Thin. Solid Films, 223, 276 (1993).
D.G. Ivey, Micron 29, 281 (1998).
A.J. Avila, Theory and Practice of Pulse Plating, ed. Puippe and Leaman, (Orlando, FL, Amer Electroplaters and Surface Finishers Soc., 1989), pp. 189–202.
J. Doesburg and D.G. Ivey, Plating and Surface Finishing 88, 78 (2001).
W. Sun and D.G. Ivey, Mater. Sci. and Eng. B 65, 111 (1999)
D.D. Perring, Organic Complexing Reagents: Structure, Behavior, and Application to Inorganic Analysis, (New York: John Wiley & Sons, 1964), p. 35.
T.B. Massalski and H.W. King, Acta Metall. 8, 677 (1960).
O. Dossenback, Theory and Practice of Pulse Plating, ed. Puippe and Leaman (Orlando, FL: Amer Electroplaters and Surface Finisher Soc., 1989) pp. 73–92.
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Djurfors, B., Ivey, D.G. Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging. J. Electron. Mater. 30, 1249–1254 (2001). https://doi.org/10.1007/s11664-001-0157-1
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DOI: https://doi.org/10.1007/s11664-001-0157-1