Abstract
The morphology and growth kinetics of intermetallic compounds formed at the interface between liquid indium and silver substrates in the temperature range from 473 K to 673 K were studied. Electron microprobe (EPMA) analysis and x-ray diffraction (XRD) revealed that the intermetallic compound Ag2In formed as scallops. The growth followed parabolic kinetics, suggesting that the growth was diffusion-controlled. Moreover, the activation energy calculated from the Arrhenius plot of growth reaction constants was 41.55 KJ/mole. Also, the relationship between the wettability of liquid indium on the surface of silver substrates and their interfacial reactions was clarified.
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Liu, Y.M., Chen, Y.L. & Chuang, T.H. Interfacial reactions between liquid indium and silver substrates. J. Electron. Mater. 29, 1047–1051 (2000). https://doi.org/10.1007/s11664-000-0171-8
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DOI: https://doi.org/10.1007/s11664-000-0171-8