Abstract
The formation and the growth of the intermetallic compound (IMC, hereafter) at the interface between the Sn-3.5Ag (numbers are all in wt.% unless otherwise specified) solder alloy and the Cu substrate were investigated. Solder joints were prepared by changing the soldering time at 250°C from 30 sec to 10 h and the morphological change of IMCs with soldering time was observed. It resulted from the competition between the growth of IMC and the dissolution of Cu from the substrate and IMCs. They were further aged at 130°C up to 800 h. During aging, the columnar morphology of IMCs changed to a more planar type while the scallop morphology remained unchanged. It was observed that the growth behavior of IMCs was closely related with the initial soldering condition.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
M. Onishi and H. Fujibuchl, Trans. JIM 16, 539 (1975).
Y. Wu, J.A. Sees, C. Pouraghabagher, L.A. Foster, J.L. Marshall, E.G. Jacobs, and R.F. Pinizzotto, J. Electron. Mater. 22, 769 (1993).
K.L. Erickson, P.L. Hopkins, and P.T. Vianco, J. Electron. Mater. 23, 729 (1994).
Z. Mel, A.J. Sunwoo, and J.W. Morris, Jr., Met. Trans. 23 A, 857 (1992).
P.T. Vianco, P.F. Hlava, and A.C. Kilgo, J. Electron. Mater. 23, 583 (1994).
P.T. Vianco, K.L. Erickson, and P.L. Hopkins, J. Electron. Mater. 23, 721 (1994).
M. Schaefer, R.A. Fournelle, and J. Liang, J. Electron. Mater. 27, 1167 (1998).
H.K. Kim and K.N. Tu, Phys. Rev. B 53, 16027 (1996).
A.J. Sunwoo, J.W. Morris, Jr., and G.K. Lucey, Jr., Met. Trans. 23 A, 1323 (1992).
B.J. Lee, N.M. Hwang, and H.M. Lee, Acta Mater. 45, 1867 (1997).
M. Schaefer, W. Laub, R.A. Fournelle, and J. Liang, Design and Reliability of Solders and Solder Interconnects, ed. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom (Warrendale, PA: TMS, 1997).
F. Bartels, J.W. Morris, Jr., G. Dalke, and W. Gust, J. Electron. Mater. 23, 787 (1994).
W.K. Choi and H.M. Lee, J. Electron. Mater. 28, 1251 (1999).
P. Hassen, Physical Metallurgy, 1st ed. (New York: Cambridge University Press, 1986).
J.H. Yao, K.R. Elder, H. Guo, and M. Grant, Phys. Rev. B 47, 14110 (1993).
J.M. Howe, Interfaces in Materials (New York: Wiley & Sons, 1997).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Choi, W.K., Lee, H.M. Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate. J. Electron. Mater. 29, 1207–1213 (2000). https://doi.org/10.1007/s11664-000-0014-7
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-000-0014-7