Abstract
Dynamic wetting angle measurements, microstructural evolution, reaction kinetics, and shear strength of infrared brazing Cu and Ti using a 95Ag-5Al braze alloy are evaluated. The specimen infrared brazed at 900 °C consists mainly of Cu2Ti and Cu4Ti. Both CuTi and Cu4Ti3 are observed at the interface between the braze and Ti substrate. Microstructures of Ti/95Ag-5Al/Cu joints infrared brazed at 830 °C and 850 °C are very different from that of the joint infrared brazed at 900 °C, because the dissolution of both substrates significantly decreased as the brazing temperature decreased. Specimens infrared brazed at 830 °C and 850 °C are primarily comprised of Ag-Cu eutectic and the Cu-rich phase. Two interfacial reaction layers, including Ti2Cu and AlCu2Ti, are found in the experiment. The shear strengths of infrared brazed specimens at 830 °C and 850 °C are between 160 and 198.5 MPa, and are fractured along the interfacial reaction layers, AlCu2Ti and Ti2Cu, between the braze alloy and Ti substrate. The use of the infrared brazing provides an effective way to inhibit the growth of intermetallics at the interface between the braze alloy and substrate.
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Shiue, R.K., Wu, S.K. & Chan, C.H. Infrared brazing Cu and Ti using a 95Ag-5Al braze alloy. Metall Mater Trans A 35, 3177–3186 (2004). https://doi.org/10.1007/s11661-004-0062-3
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DOI: https://doi.org/10.1007/s11661-004-0062-3