Abstract
This article describes a method of electroless gold deposition on a Si(100) wafer having a silver surface as seed layer. The seed layer was firstly deposited onto the surface of an etched wafer in an acidic solution of 0.005 mol/L AgNO3+0.06 mol/LHF. The electroless gold deposition is performed by immersing the Ag-activated wafer in an electroless bath with a composition of 1.27×10-3 mol/L [AuCl4]-+2.00×10-2 mol/L NaH2PO2+8.32×10-2 mol/L NH2CH2CH2NH2 (pH = 9.0–9.5). The bath temperature is 50–70 °C. The morphology of the seed layer and the gold film were characterized by atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS).
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
V.M. Dubin, Y. Shacham-Diamand, B. Zhao, P.K. Vasudev, C.H. Ting: J. Electrochem. Soc. 144, 898 (1997)
J.S.H. Cho, H. Kang, S.S. Wong, Y. Shacham-Diamand: MRS Bull. 18, 31 (1993)
L. Magagnin, R. Maboudian, C. Carrao: Electrochem. Solid State Lett. 4, C5 (2001)
Y. Shacham-Diamand, A. Dedhia, D. Hoffstetter, W.G. Oldham: J. Electrochem. Soc. 140, 2427 (1993)
G. Raghavan, C. Chiang, P.B. Anders, S.M. Tzeng, R. Villasol, G. Bai, M. Bohr, D.B. Fraser: Thin Solid Films 262, 168 (1995)
J. Li, Y. Shacham-Diamand, J.W. Mayer: Mater. Sci. 9, 1 (1992)
A. Kohn, M. Eizenberg, Y. Shacham-Diamand. Y. Sverdlov: Mater. Sci. Eng. A 302, 18 (2001)
P. Backus, H. Mahlkow, C. Wunderlich: US Patent No. 6 336 962 (2002)
A. Inherg, L. Zhu, G. Hirschberg, A. Gladkikh, N. Croiyoru, Y. Shacham-Diamand, E. Gileadi: J. Electrochem. Soc. 148, C784 (2001)
Y. Shacham-Diamand, A. Inberg, Y. Sverdlov, N. Croitoru: J. Electrochem. Soc. 147, 3345 (2000)
G.L. Ballard, R.D. Edwards, J.G. Gaudiello, V.R. Markovich: US Patent No. 6 383 617 (2002)
M. Kato, J. Sato, H. Otani, T. Homma, Y. Okinaka, T. Osaka, O. Yoshioka: J. Electrochem. Soc. 149, C164 (2002)
C.J. Sambucetti, J.M. Rubino, D.C. Edelstein, J.C. Cabral, G.F. Walker, J.G. Gaudiello, H.S. Wildman: US Patent No. 6 323 128 (2001)
T. Osaka, T. Misato, J. Sato, H. Akiya, T. Homma, M. Kato, Y. Okinaka, O. Yoshioka: J. Electrochem. Soc. 147, 1059 (2000)
S. Warren, A. Reitzle, A. Kazimirov, J.C. Ziegler, O. Bunk, L.X. Cao, F.U. Renner, D.M. Kolb, M.J. Bedzyk, J. Zegenhagen: Surf. Sci. 496, 287 (2002)
S.W. Lim, R.T. Mo, P.A. Pianetta, C.E.D. Chidsey: J. Electrochem. Soc. 148, C16 (2001)
J.E. Huheey: Inorganic Chemistry, 2nd edn. (Harper and Row, New York 1978) p. 276
Y. Zhu: A Handbook of Electrochemical Data (Hunan Science and Technology Press 1984) p. 14
Author information
Authors and Affiliations
Corresponding author
Additional information
PACS
82.45.Mp; 81.15.Pq; 81.10.Dn
Rights and permissions
About this article
Cite this article
Jing, F., Tong, H., Kong, L. et al. Electroless gold deposition on silicon(100) wafer based on a seed layer of silver. Appl. Phys. A 80, 597–600 (2005). https://doi.org/10.1007/s00339-003-2236-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00339-003-2236-z