Abstract
This paper mainly focuses on the fabrication process of diamond ultra-small micro-grinding tool, on which a novel fabrication method is presented and applied. Models for tool substrate (tungsten carbide) machining and tool electroplating in this new method are built, during which the inclined angle (θ) and the electroplating thickness value (δtp) of point discharge effect are considered. By this method, a series of ultra-small micro-grinding tools, whose diameters are from 6 to 120 μm, are successfully fabricated. The deposition velocity of electroplating layer caused by point discharge effect (vtp) is found to be influenced mainly by cathode-current density (Dk). The critical Dk value for the occurrence of point effect is delayed to above 0.6 A/dm2 from conventional of about 0.3 A/dm2, almost tripled than the traditional way. The effect caused by tool diameter (d0) to electroplating thickness (δmt) is found to be irregular based on a comparison of the equivalent thickness (δme). By conducting a group of micro-grinding experiments on single crystal silicon, the brittle-ductile transition is observed. Above all, an ultra-small micro-grinding tool, whose diameter (ds) is less than 20 μm and the length-to-diameter ratio (L/D) is larger than 1:50, is fabricated, and this is the most extreme length-to-diameter ratio in this scale. The ultra-small micro-grinding tool manufactured by this method is successfully verified by experiments. This study is quite meaningful for promoting the development of precision micro-machining industry.
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Funding
This paper work is supported by the National Natural Science Fund of China (No. 51575096). The authors would like to thank the support of Shenzhen Changxing Technology Co., Ltd., China.
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Cheng, J., Wu, J. Experimental study on the fabrication method of diamond ultra-small micro-grinding tool. Int J Adv Manuf Technol 97, 1431–1444 (2018). https://doi.org/10.1007/s00170-018-2047-1
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DOI: https://doi.org/10.1007/s00170-018-2047-1