Abstract
Potassium dihydrogen phosphate (KDP) crystal is the preferred nonlinear optical crystal used in pockels cell and frequency multiplier. Slicing machining is the first process for KDP crystal, which has an important effect on the yield rate. However, KDP crystal is easy to crack when sliced due to the maximum tensile stress. This paper presents the finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal. The finite element model of wire sawing KDP crystal is found, and the sawing forces are analyzed and loaded to the cutting kerf that are simplified as the normal sawing pressure p contrary to the workpiece feed direction and the tangential sawing pressure q along the wire moving direction, based on the analysis of fixed-abrasive wire saw cutting mechanism. The dynamic distribution and variation rule of the sawing stress and the coupling of sawing stress with crystal initial internal stress have been analyzed when slicing the (001) crystal plane optical device, and the critical initial internal stress of the KDP crystal to avoid cracking in wire saw cutting is discussed. Numerical simulation results show that the sawing stress for cutting KDP crystal without initial internal stress is a low-stress machining way, but a larger tensile stress produces due to the initial stress gathering in the kerf coupled with the low sawing stress. A greater crystal initial internal stress can lead to the more intense concentration of sawing stress; it suggests that the initial internal stress inside the sawed KDP crystal should be less than 2.294 MPa. The research results help to further understand the sawing stress field distribution and change in the process of slicing KDP crystal.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Chen MJ, Pang QL, Wang JH, Cheng K (2008) Analysis of 3D microtopography in machined KDP crystal surfaces based on fractal and wavelet methods. Int J Mach Tools Manuf 48:905–913
Jiao Y, Ge PQ, Gao YF, Bi WB (2014) Analysis of temperature and thermal stress distribution on KDP crystal wire saw slicing. Adv Mater Res 1027:28–31
Deng LM, Duan J, Zeng XY, Yang H, Huang S (2013) A study on dual laser beam separation technology of KDP crystal. Int J Mach Tools Manuf 72:1–10
Deng LM, Yang H, Zeng XY, Wu BY, Liu P, Wang XZ, Duan J (2015) Study on mechanics and key technologies of laser nondestructive mirror-separation for KDP crystal. Int J Mach Tools Manuf 94:26–36
Chen N, Mingjun Chen MJ, Guo YQ, Wang XB (2015) Effect of cutting parameters on surface quality in ductile cutting of KDP crystal using self-developed micro PCD ball end mill. Int J Adv Manuf Technol 78:221–229
Zong WJ, Li ZQ, Zhang L, Liang YC, Sun T, An CH, Zhang JF, Zhou L, Wang J (2013) Finite element simulation of diamond tool geometries affecting the 3D surface topography in fly cutting of KDP crystals. Int J Adv Manuf Technol 68:1927–1936
Chen DS, Chen JH, Wang BR (2016) A hybrid method for crackless and high-efficiency ultraprecision chamfering of KDP crystal. Int J Adv Manuf Technol 87:293–302
Wang X, Gao H, Chen YC, Guo DM (2016) A water dissolution method for removing micro-waviness caused by SPDT process on KDP crystals. Int J Adv Manuf Technol 85:1374–1360
Zhang N, Zhang QY, WANG SL, Sun Y (2011) Research on cutting effects of the large-size KDP crystal by numerical simulation method. J Synth Cryst 40(2):323–328
Gao YF, Ge PQ, Liu TY (2016) Experiment study on electroplated diamond wire saw slicing single-crystal silicon. Mat Sci Semicon Proc 56:106–114
Clark WI, Shih, AJ, Lemaster RL, McSpadden SB (2003) Fixed abrasive diamond wire machining—part II: experiment design and results. Int J Mach Tool Manu 43533–542
Chung C, Tsay GD, Tsai MH (2014) Distribution of diamond grains in fixed abrasive wire sawing process. Int J Adv Manuf Technol 73:1485–1494
Ge MR, Bi WB, Ge PQ, Bi YC (2016) Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw. Int J Adv Manuf Technol. doi:10.1007/s00170-016-8577-5
Huang H, Zhang YX, Xu XP (2015) Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire. Int J Adv Manuf Technol 81:955–965
Yang FQ, Kao I (2001) Free abrasive machining in slicing brittle materials with wiresaw. J Electron Packaging 123:254–259
Gao YF, Ge PQ, Bi WB, Bi YC (2013) Study on surface defects of KDP crystal sawed by diamond wire saw. J Synth Cryst 42(7):1278–1282
Brun XF, Melkote SN (2009) Analysis of stresses and breakage of crystalline silicon wafers during handling and transport. Sol Energ Mat Sol C 94:1238–1247
Zhang QY, Zhang N, Wang SL, Sun Y (2009) Analysis of the size effect of crack generation in the large-scale KDP crystals during its growth. J Funct Mater 40(9):1584–1590
Zhang N, Zhang QY, Wang SL, Sun Y (2011) Analysis of mechanical effects for the cracks in large-sacle KDP crystals during getting out from crystallizers with numerical simulation method. J Funct Mater 42(12):2133–2136
Fang T, Lambropoulos JC (2002) Microhardness and indentation fracture of potassium dihydrogen phosphate (KDP). J Am Ceram Soc 85(1):174–178
Zhang QY, Liu DJ, Wang SL, Zhang N, Mou XM, Sun Y (2009) Mechanical parameters test and analysis for KDP crystal. J Synth Cryst 38(6):1313–1319
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Ge, M., Gao, Y., Ge, P. et al. A finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal. Int J Adv Manuf Technol 91, 2049–2057 (2017). https://doi.org/10.1007/s00170-016-9916-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-016-9916-2