Abstract
As grinding force plays an influential role in work-surface finish in grinding process, a model is necessary for optimizing input variables to achieve high product quality and productivity. However, to the best of our knowledge, there are few reports on modeling grinding force in ultrasonic assisted internal grinding (UAIG). In this study, a theoretical model is presented to predict the grinding force in UAIG of SiC ceramics. This model stems from undeformed chip length resulting from the relative motion between the grinding wheel and the workpiece. After analyzing the cutting action of an active individual grain, normal and tangential force models for the UAIG of SiC ceramics are developed. Using the developed model, the influence of many principal input variables, namely the workpiece rotational speed n w , the wheel infeed rate V c , the wheel rotational speed n g , the UV amplitude A u , and the oscillation frequency f o , on grinding force is predicted. Comparing the predicted forces with the experimental ones, it is shown that the predicted forces agree reasonably well with the experimental ones. The obtained results show that (1) the grinding forces are reduced in the UAIG compared to conventional internal grinding, which is attributed to the formation of the longer undeformed chip length in the UAIG; (2) the influence of n g , n w , and V c on grinding force are much pronounced, whereas that of A u and f o are not very noticeable; and (3) the force reduction of UV can be enhanced either by decreasing n g , n w , and V c or increasing A u and f o .
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Cao, J., Wu, Y., Li, J. et al. A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics. Int J Adv Manuf Technol 81, 875–885 (2015). https://doi.org/10.1007/s00170-015-7282-0
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DOI: https://doi.org/10.1007/s00170-015-7282-0