Abstract
In this paper, we developed a fast and robust machine vision system for wire bonding inspection. The defects caused by a bonding wire being broken, lost, shifted, shorted, or sagged in an integrated circuit (IC) chip can be inspected automatically. A new lighting environment was devised which will highlight the slope of the bonding wire and suppress the background from being extracted. First, a set of machine vision algorithms were designed to filter out the defects of broken wire, lost wire, shifted wire, and shorted-out wire. Second, the 3-D type defect of sagged wire can be detected by inspecting the change of the bonding wire slope, derived from a single 2-D image. Some illustrations are given to show the efficiency and effectiveness of the proposed novel wire bonding vision inspection system.
Article PDF
Similar content being viewed by others
Explore related subjects
Discover the latest articles, news and stories from top researchers in related subjects.Avoid common mistakes on your manuscript.
References
Orbotech Ltd., home page at http://www.orbotech.com. Camtek Ltd., home page at http://www.camtek.co.il. Firfax Systems Ltd., home page at http://www.firfaxsystems.co.uk
Perng D-B, Chou C-C, Lee S-M (2003) A new wire bonding inspection system by machine vision. In: Proceedings of the 7th International Conference on Automation Technology, National Chung Cheng University, Taiwan, May 2003, pp 228–233
Ahmed M, Cole CE, Jain RC, Rao AR (1990) INSPAD: a system for automatic bond pad inspection. IEEE Trans Semiconduct Manufact 3(3):145–147
Khotanzad A, Banerjee H, Srinath MD (1992) A vision system for inspection of ball bonds in integrated circuits. In: Proceedings of the IEEE Workshop on Applications of Computer Vision, Palm Springs, California, November/December 1992, pp 290–297
Khotanzad A, Banerjee H, Srinath MD (1994) A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits. IEEE Trans Semiconduct Manufact 7(4):413–422
Gonzalez RC, Woods RE (1987) Digital image processing, 2nd edn. Addison-Wesley, Boston, Massachusetts, pp 419–420
Otsu N (1979) A threshold selection method from gray-level histograms. IEEE Trans Syst Man Cybern 9(1):62–66
Haralick RM, Shapiro LG (1992) Computer and robot vision. Addison-Wesley, Reading, Massachusetts, pp 639–658
Ngan KN, Kang SB (1988) Automated inspection of IC bonding wires using Hough transform. In: Proceedings of the 14th Conference of the IEEE Industrial Electronics Society (IECON), Singapore, October 1988, vol 4, pp 938–942
Pratt WK (1978) Digital image processing. Wiley, New York, pp 613–622
Ye QZ, Ong SH, Han X (2000) A stereo vision system for the inspection of IC bonding wires. Int J Imaging Syst Technol 11(4):254–262
Petrou M (1993) Optimal convolution filters and an algorithm for the detection of wide linear features. IEE Proc I 140(5):331–339
Haralick RM, Shapiro LG (1992) Computer and robot vision, vol 1. Addison-Wesley, Reading, Massachusetts, pp 371–392
Perng D-B, Liu C-P, Chen Y-C, Chou C-C (2002) Advanced PCB vision inspection machine development. In: Proceedings of the International Manufacturing Leaders Forum (IMLF 2002), Adelaide, Australia, February 2002, pp 95–100
Acknowledgment
This work is partly supported by the National Science Council of Taiwan, R.O.C., under contracts NSC 92-2213-E-009-103 and NSC 93-2213-E-009-038.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Perng, DB., Chou, CC. & Lee, SM. Design and development of a new machine vision wire bonding inspection system. Int J Adv Manuf Technol 34, 323–334 (2007). https://doi.org/10.1007/s00170-006-0611-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-006-0611-6