Abstract
In recent years fluids containing suspension of nanometer sized particles have been an active area of research due to their enhanced thermo physical properties over the base fluids like water, oil etc. Nanofluids possess immense potential applications to improve heat transfer and energy efficient in several areas including automobile, micro electronics, nuclear, space and power generation. Nowadays most of the researchers are trying to use the nanofluids in automobile for various applications such as coolant, fuel additives, lubricant, shock absorber and refrigerant. The goal of this paper is to create the awareness on the promise of nanofluids and the impact it will have on the future automotive industry. This paper also presents a comprehensive data of nanofluids application in automobile for various aspects.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Kluwer Academic Publ., J. Nanopart. Res. 3, 353 (2001). doi:10.1023/A:1013248621015
S. U. S. Choi, ASME, 99 (1995).
S. U. S. Choi, Korea-U.S. Technical Conference on Strategic Technologies, Vienna, VA (1998).
S. Lee, S. U. S. Choi, S. Li and J. A. Eastman, J. Heat Transf. 121, 280 (1999). doi:10.1115/1.2825978
J. A. Eastman, S. U. S. Choi, S. Li, W. Yu and L. J. Thompson, Appl. Phys. Lett. 78, 718 (2001). doi:10.1063/1.1341218
S. A. Putanm, D. G. Cahill and P. V. Braun, J. Appl. Phys. 99, 084308 (2006). doi:10.1063/1.2189933
R. Rusconi, E. Rodari and R. Piazza, Appl. Phys. Lett. 89, 261916 (2006). doi:10.1063/1.2425015
J. Buongiorno, J. Heat Transf. 128, 240 (2006). doi:10.1115/1.2150834
R. Chein and G. Huang, Appl. Therm. Eng. 25, 3104 (2005). doi:10.1016/j.applthermaleng.2005.03.008
S. G. Etemad, S. Z. Heris and M. N. Esfahany, Int. J. Heat Mass Transfer 33, 529 (2006). doi:10.1016/j.icheatmasstransfer.2006.01.005
M. A. M. Said and R. K. Agarwal, 38th AIAA Thermophysics Conference, Toronto, Ontario, Canada 1 (2005).
Y. Xuan and Q. Li, J. Heat Transf. 125, 151 (2003). doi:10.1115/1.1532008
J. Kim, Y. T. Kang and C. K. Choi, Phys. Fluids 16, 2395 (2004a). doi:10.1063/1.1739247
W. Yu, D. M. France, J. L. Routbort and S. U. S. Choi, Heat Transfer Eng. 29, 432 (2008).
D. Singh, J. Toutbourt, G. Chen et al, Annual report Argonee National lab (2006).
V. Vasu, K. Ramakrishna and A. C. S. kumar, Int. J. Nano Technol. Appl. 2, 75 (2008).
S. T. Zeng, C. Lin and K. Huang, Acta. Mechanica. 179, 11 (2005). doi:10.1007/s00707-005-0248-9
Z. Zhang and Q. Que, Wear 209, 8 (1997).
Interagency working group on nano science, national nano technology initiative: Leading to the next industrial revolution, Technology National Science and Technology Council, USA, February (2000).
M. J. Kao, C. C. Tin, B. F. Lin et al., J. Test. Eval. 36, 186 (2007).
V. A. M. Selvan, R. B. Anand and M. Udayakumar, J. Eng. Appl. Sci. 4, 1 (2009).
H. Masuda, A. Ebata, K. Teramae and N. Hishinuma, Netsu Bussei (Japan) 7, 227 (1993).
J. A. Eastman, S. U. S. Choi, S. Li, L. J. Thompson and S. Lee, Fall Meeting of the Materials Research Society (MRS), Boston, USA, (1996).
B. C. Pak and Y. I. Cho, Exp. Heat Transfer 11(2), 151 (1998). doi:10.1080/08916159808946559
X. Wang, X. Xu and S. U. S. Choi, J. Thermophys. Heat Tr. 13(4), 474 (1999).
S. Lee, S. U. S. Choi, S. Li and J. A. Eastman, Transactions of the ASME. J. Heat Transf. 121(2), 280 (1999). doi:10.1115/1.2825978
H. E. Patel, S. K. Das, T. Sundararajan, A. Sreekumaran Nair, B. George and T. Pradeep, Appl. Phys. Lett. 83(14), 2931 (2003). doi:10.1063/1.1602578
H. W. Xie, T. J. Xi, Y. Liu, F. Ai and Q. Wu, J. Appl. Phys. 91(7), 4568 (2002). doi:10.1063/1.1454184
R. Prasher, P. Bhattacharya and P. E. Phelan, Phys. Rev. Lett. 94(2), 025901 (2005). doi:10.1103/PhysRevLett. 94.025901
S. Krishnamurthy, P. Bhattacharya, P. E. Phelan and R. S. Prasher, Nano Lett. 6(3), 419 (2006). doi:10.1021/nl0 522532
M. S. Liu, C. C. Lin, I. T. Huang and C. C. Wang, Chem. Eng. Technol. 29(1), 72 (2006). doi:10.1002/ceat.200 500184
S. M. S. Murshed, K. C. Leong and C. Yang, Int. J. Therm. Sci. 44(4), 367 (2005). doi:10.1016/j.ijthermalsci.2004.12.005
Z. W. Li, C. J. Ho and L. C. Wei, Appl. Therm. Eng. 30, 96 (2010). doi:10.1016/j.applthermaleng.2009.07.003
S. V. Ravikanth, K. D. Debendra and K. N. Praveen, Int. J. Heat Fluid Flow 31, 613 (2010). doi:10.1016/j.ijheat fluidflow.2010.02.016
P. K. Devdatta, S. V. Ravikanth, K. D. Debendra and O. Daniel, Appl. Therm. Eng. 28, 1774 (2008). doi:10.1016/j.applthermaleng.2007.11.017
G. Paul, T. Pal and I. Manna, J. Colloid Interface Sci. 349, 434 (2010). doi:10.1016/j.jcis.2010.05.086
B. A. Hernández, J. L. Viesca, R. González, D. Blanco, E. Asedegbega and A. Osorio, Wear 268, 325 (2010).
M. J. Kao and C. R. Lin, J. Alloy. Compd. 483, 456 (2009). doi:10.1016/j.jallcom.2008.07.223
Y. Gan and L. Qiao, Combustion and Flame 158, 354 (2011).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made.
The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder.
To view a copy of this licence, visit https://creativecommons.org/licenses/by/4.0/.
About this article
Cite this article
Senthilraja, S., Karthikeyan, M. & Gangadevi, R. Nanofluid Applications in Future Automobiles: Comprehensive Review of Existing Data. Nano-Micro Lett. 2, 306–310 (2010). https://doi.org/10.1007/BF03353859
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/BF03353859