Abstract
The replacement of a direct by a pulsed current in the electrodeposition of gold has a marked effect in improving the mechanical properties of the deposits and in reducing their internal stresses. For many applications in the electronics industry pulse plating therefore offers considerable advantages.
Similar content being viewed by others
References
G. W. Jemstedt,Proc. Am. Electroplaters’ Soc., 1949,36, 63; 1950,37, 151
A. P. Popkov,J. Appl. Chem. U.S.S.R., 1966,39, (8), 1632
A. M. Ozerov, N. P. Litvishko, I. N. Vavilina, P. M. Chetvertnov and Ya. E. Zhak,J. Appl. Chem. U.S.S.R., 1967,40, (5), 1101
A. Hickling and H. P. Rothbaum,Trans. Inst. Met. Finish., 1957,34, 199
C. C. Wan, H. Y. Cheh and H. B. Linford,Plating, 1974,61, (6), 559
J. Lendvay and Ch. J. Raub,Metalloberfläche, 1975,29, (4), 165
M. Viswanathan and Ch. J. Raub,Surface Technol 1976,4, (4), 339
A. J. Avila and M. J. Brown,Plating, 1970,57, (11), 1105
M Viswanathan and Ch. J. Raub,Galvanotechnik, 1975,66, (4), 277
R. I. Gurovich and A. K. Krivtsov,Zh. Prikl. Khim. (Leningrad) 1968,41, (6), 1227
C. L. Faust, G. R. Schaer and D, E. Semones,Plating, 1961,48, (6), 605
A. Knödler,Galvanotechnik, 1970,61, (4), 290
H. Schreiner and Ch. J. Raub,Z. Werkstofftech., 1975,6, (12), 414
W. W. Pcihoda and A. E. Walker,Electron, Packag. Prod., 1975,15, (6), 74
D. L. Rehrig,Plating 1974,61, (1), 43
C. A. Burrus,J. Electrochem. Soc., 1971,118, (5), 833
H. Y. Cheh,J. Electrochem. Soc., 1971,118, (4), 551
F. H. Reid,Metalloberfläche, 1976,30, (10), 453
A, Knödler,Galvanotechniki 1977, in the press
A. Knödler,Metalloberfläche, 1974,28, (12), 465
A. S. Darling,Gold Bull, 1972,5, (4), 74
G. B. Munier,Plating, 1969,56, (10), 1151
M. Antler,Plating, 1973,60, (5), 468
Ch. J. Raub, and J. Lendvay, unpublished results
Ch. J. Raub, H. R. Khan and J. Lendvay,Gold Bull., 1976,9, (4), 123
A. F. Mohrnheim,J. Electrochem. Soc., 1970,117, (6), 833
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Raub, C.J., Knödler, A. The electrodeposition of gold by pulse plating. Gold Bull 10, 38–44 (1977). https://doi.org/10.1007/BF03215426
Issue Date:
DOI: https://doi.org/10.1007/BF03215426