Abstract
The ability of rapid conduction cooling to produce new non-equilibrium phases is examined with particular attention on solidification rate. By matching the rate of solidification calculated numerically from the heat flow balance with the crystal growth rate calculated by a kinetic equation, the kinetic undercooling for a given experimental condition is estimated. A limiting condition of cooling is presented in which the cooling rate is so large that the crystal growth cannot cover the whole sample body before it is cooled down to a low temperature where the growth rate of the crystal is negligibly small.
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Shingu, P.H., Ozaki, R. Solidification rate in rapid conduction cooling. Metall Trans A 6, 33–37 (1975). https://doi.org/10.1007/BF02673667
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DOI: https://doi.org/10.1007/BF02673667