Abstract
The applicability of conventional models of the transient liquid-phase (TLP) bonding process to the joining of nickel using ternary Ni-Si-B insert metals is considered in this article. It is suggested that diffusion of boron out of the liquid and into the solid substrate before the equilibration of the liquid and solid phases can result in the development of significant boron concentrations in the substrate. This, in turn, leads to the precipitation of boride phases in the substrate during holding at bonding temperatures below the binary nickel-boron eutectic temperature. The formation of boride phases during holding at the bonding temperature is of importance, because first, it is not predicted by the standard models of the TLP process, and second, the borides are not removed by prolonged holding at the bonding temperature and therefore may influence the in-service properties of the joint. In contrast, when bonding above the binary nickel-boron eutectic temperature, localized liquation of the substrate takes place. This liquid region resolidifies following prolonged holding and does not result in the formation of persistent boride phases. Experimental support is presented for the formation of borides during bonding, and characterization of the boride phases formed in the substrate is described.
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Gale, W.F., Wallach, E.R. Microstructural development in transient liquid-phase bonding. Metall Trans A 22, 2451–2457 (1991). https://doi.org/10.1007/BF02665011
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DOI: https://doi.org/10.1007/BF02665011