Abstract
The precipitation processes that accompany the aging of supersaturatedα-titanium solid solutions containing up to 6 wt pct Cu have been studied by thin foil electron microscopy and X-ray diffraction techniques. Two mechanisms of decomposition have been identified: i) the heterogeneous nucleation and growth of Ti2Cu at interfaces and internal substructure such as dislocations, and ii) the uniform nucleation of thin, coherent, disk-shaped precipitates which lie on\(\{ 10\overline 1 1\} \). The coherent precipitates can form with densities up to 1017 per cu cm; this and many morphological features of the precipitation process in Ti-Cu are analogous to the well-known behavior of Al-Cu alloys. The coherent precipitates first lose coherency along the edge of the disk and then along the flat faces. The mechanisms by which these two processes occur are considered in detail.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
D. N. Williams, R. A. Wood, H. R. Ogden, and R. I. Jaffee:Trans. TMS-AIME, 1960, vol. 218, p. 787.
W. C. Gallaugher, R. Taggart, and D. H. Polonis:Trans. TMS-AIME, 1965, vol. 233, p. 944.
M. J. Blackburn and J. C. Williams:Trans. TMS-AIME, 1967, vol. 239, p. 287.
J.C. Williams, R. Taggart, and D. H. Polonis:The Science, Technology and Application of Titanium, R. Jaffee and N. Promisel, eds., pp. 733-43, Pergamon Press, 1970.0
G. D. Preston:Phil. Mag., 1938, vol. 26, p. 855.
A. Guinier:Ann. Phys., 1939, vol. 12, p. 161.
J. Silcock:ActaMet., 1958, vol. 6, p. 481.
M. J. Blackburn and J. C. Williams:Trans. TMS-AIME, 1968, vol. 242, p. 2461.
M. F. Ashby and L. M. Brown:Phil. Mag., 1963, vol. 8, p. 1083.
M. F. Ashby and L. M. Brown:Phil. Mag., 1963, vol. 8, p. 1649.
J. W. Cahn:Acta Met., 1957, vol. 5, p. 168.
R. B. Nicholson:Electron Microscopy and Strength of Crystals, G. Thomas and J. Washburn, eds., p. 861, Interscience, New York, 1963.
E. Hornbogen:Aluminium, 1967, vol. 43, p. 19.
A. Kelly and R. B. Nicholson:Prog. Mater. Sci., 1963, vol. 10, p. 151.
H. Brooks:Metal Interfaces, p. 20, ASM, Cleveland, Ohio, 1952.
F. R. N. Nabarro:Proc. Phys. Soc, 1940, vol. 52, p. 90.
F. R. N. Nabarro:Proc.Roy. Soc, 1940, vol. Al75, p. 519.
G. A. Alers: North American Rockwell Science Center, Thousand Oaks, Calif., private communicaiton, 1970.
P. B. Hirsch, A. Howie, R. B. Nicholosn, D. W. Pashley, and M. J. Whelan:Electron Microscopy of Thin Crystals, p. 34, Butterworths, London, 1965.
H. I. Aaronson and C. Laird:Trans. TMS-AIME, 1968, vol. 242, p. 1393.
Author information
Authors and Affiliations
Additional information
Formerly Predoctoral Research Associate, University of Washington, Seattle, Wash.
Rights and permissions
About this article
Cite this article
Williams, J.C., Taggart, R. & Polonis, D.H. An electron microscopy study of modes of intermetallic precipitation in Ti-Cu alloys. Metall Trans 2, 1139–1148 (1971). https://doi.org/10.1007/BF02664246
Received:
Issue Date:
DOI: https://doi.org/10.1007/BF02664246