Abstract
Thermally stimulated discharge (TSD) is used to characterize fractional components of epoxy encapsulation systems used on semiconductor devices. Previous work is reviewed. Present results based on individual components and component interactions are detailed. Various resin/hardener systems are examined and are not found to be major contributors to TSD structure when balanced by epoxy equivalent weight. Catalyst additions reveal increased TSD structure, especially for low levels. TSD is suggested as a cure indicator for epoxy systems. Moisture is found to resolve thermogram structure, and TSD is found to be a viable method of studying moisture effects.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Woodard, J. B., 14th Annual Proceedings - Reliability Physics 1976 (IEEE), p. 234.
Van Turnhout, J.,Thermally Stimulated Discharge of Polymer Electrets, Elsevier, New York (1975).
Shechter, L., Wynstra, J. and Kurkjy, R. P., Industrial and Engineering Chemistry48, 86 (1956).
Olberg, R. C, J. Electrochem. Soc.118, 129 (1971).
Nufer, R. W. and Anderson, L. C., Sol. State Tech., August 1971, p. 33.
Atalla, M. M., Bray, A. R., Lindner, R., Proc. IEEE (London)106, 1130 (1959).
Shockley, W., Quiesser, H. J., and Hooper, W. W., Phys. Rev. Lett.11, 489 (1963).
Shockley, W., Hooper, W. W., Queisser, H. J. and Schroen, W., Surf. Sci.2, 277 (1964).
Schlegel, E. S., Schnable, G. L., Schwarz, R. F. and Spratt, J. P., IEEE Transactions on Electron DevicesED-15, No. 12, 973 (1968).
Schlegel, E. S., Keen, R. S., Schnable, G. L., 8th Annual Proceedings - Reliability Physics 1970 (IEEE), p. 9.
Wakashima, Y., Inayashi, H., Nishi, K., Nishida, S., l4th Annual Proceedings - Reliability Physics 1976 (IEEE), p. 223.
May, C. A. and Tanaka, Y.,Epoxy Resins, Dekker, New York (1973) p. 339.
Ibid., p. 688.
Sampson, R. N., and Lesnick, J. P., Mod. Plastics35, 150 (1958); SPE Journ.14, 33 (1958).
Dannenberg, H., SPE Journ.21, 7 (1965).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Woodard, J.B. Thermally stimulated discharge in fractional component and moisture effect studies of epoxy encapsulants. J. Electron. Mater. 6, 145–162 (1977). https://doi.org/10.1007/BF02660380
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF02660380