Abstract
Solders of nominal 95Pb-5Sn and 60Sn-40Pb were used to join Cu plates. The effect of ternary additions of In, Ag, Sb, and Bi to the near-eutectic solder were also investigated. Bulk solder and interfacial joint microstructures were characterized for each solder alloy. The solder joints were strained to failure in tension; joint strength and failure mode were determined. 95Pb-5Sn/Cu and 60Sn-40Pb/Cu specimens were tested both as-processed and after reflow. 95Pb-5Sn/Cu as-processed and reflow specimens failed in tension in a ductile mode. Voids initiated at β-Sn precipitates in the as-processed specimens and at the Cu3Sn intermetallic in the reflow specimens. 60Sn-40Pb/Cu failed transgranularly through the Cu6Sn5 intermetallic in both the as-processed and reflow conditions. The joint tensile strength of the reflow specimens was approximately half that of the as-processed specimens for both the high-Pb and near-eutectic alloys. The Cu6Sn{5} intermetallic dominated the tensile failure mode of the near-eutectic solder/Cu joints. The fracture path of the near-eutectic alloys with ternary additions depended on the presence of Cu6Sn5 rods in the solder within the Cu plates. Specimens with ternary additions of In and Ag contained only interfacial intermetallics and exhibited interfacial failure at the Cu6Sn5. Joints manufactured with ternary additions of Sb and Bi contained rods of Cu6Sn5 within the solder. Tensile failure of the Sb and Bi specimens occurred through the solder at the Cu6Sn5 rods.
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Quan, L., Frear, D., Grivas, D. et al. Tensile behavior of pb-sn solder/cu joints. J. Electron. Mater. 16, 203–208 (1987). https://doi.org/10.1007/BF02655488
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DOI: https://doi.org/10.1007/BF02655488