Abstract
The solder/base metal interfacial chemistry characterizing solder joints impacts the manufacturability and reliability of electronic components. A model was developed to predict the long-term diffusion-controlled growth of interfacial intermetallic compound layers using short-term experimental data. The model included terms for both constant and variable diffusion coefficients. Application of the model was demonstrated using parameter values for 100Sn/Cu system and comparing calculated layer thicknesses with the experimentally observed values. The early time data for the 100Sn/Cu system that were used to predict growth at longer times were characterized using a variable diffusion coefficient that was an empirical function of layer thickness.
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References
W. Jost,Diffusion in Solids, Liquids, Gases, (New York: Academic Press, 1960), p. 69.
J.M. Hyman,Method of Lines Approach to the Numerical Solution of Conservation Laws, LA-UR-79-837, (Los Alamos, NM: Los Alamos Scientific Laboratory, 1979).
L.F. Shampine and H.A. Watts,DEPAC-Design of a User Oriented Package of ODE Solvers, SAND79-2374, (Albuquer-que, NM: Sandia National Laboratories, 1980).
A.C. Hindmarsh,ODE Solvers for Use with the Method-of- Lines, UCRL-85293 (Rev. 1), (Livermore, CA: Lawrence Livermore National Laboratories, 1981).
R.J. Gross, M.R. Baer, and M.L. Hobbs,XCHEM-1D A Heat Transfer / Chemical Kinetics Computer Program for Multilay- ered Reactive Materials, SAND93-1603, (Albuquerque, NM: Sandia National Laboratories, 1993).
M.R. Baer, R.E. Benner, R.J. Gross, and J.W. Nunziato,Lectures in Applied Mechanics, 24 (1986).
P. Kofstad,High Temperature Oxidation of Metals, (New York: John Wiley & Sons, Inc., 1966), p. 140.
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Erickson, K.L., Hopkins, P.L. & Vianco, P. Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part II: Modeling. J. Electron. Mater. 23, 729–734 (1994). https://doi.org/10.1007/BF02651366
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DOI: https://doi.org/10.1007/BF02651366