Abstract
Tin and tin-lead coatings electro-plated in various solutions have been observed by means of high voltage electron microscopy, and the grain size effect of the coatings on whisker growth has been examined. As a result, it was found that the tin and tin-lead coatings from which whiskers hardly grew consisted of well-polygonized grains which were a few micrometre in size, and that the tin coatings from which whiskers easily grew consisted of irregular-shaped grains which were a few tenths of a micrometre in size. The irregularshaped grains contained dislocation rings which might be formed by clustering of vacancies or interstitial atoms upon electro-plating.
Article PDF
Similar content being viewed by others
Explore related subjects
Discover the latest articles, news and stories from top researchers in related subjects.Avoid common mistakes on your manuscript.
References
A. Politcycki and H. F. Kehree, Z. Metallk. 59 (1968) 309.
S. C. Britton and M. Clarke, Trans. Inst. Inst. Met. Finish. 40 (1963) 205.
K. G. Compton, A. Mendizza and S. M. Arnold, Corns. 7 (1951) 327.
S. C. Britton, Trans. Inst. Met. Finish. 52 (1974) 95.
S. M. Arnold, “Bell Systems Technical Publication” Monograph 2 (Bell Telephone Laboratory, New York, 1954) p. 338.
R. M. Fisher, L. S. Darken and K. G. Carroll, Acta Met. 2 (1954) 368.
S. S. Brenner, “Growth and Perfection of Crystals” (John Wiley and Sons Inc., New York and Chichester, 1957) p. 158.
R. R. Hasiguit, Acta Met. 3 (1955) 200.
V. K. Glaznova and N. T. Kudryavtsev, J. Appl. Chem. USSR, 36 (1963) 519.
S. M. Arnold, Plating 53 (1966) 96.
M. Rozen, Plating 55 (1968) 1155.
S. M. Arnold and S. E. Koonce, J. Appl. Phys. 24 (1953) 365.
S. M. Arnold, Technical Proceedings of the 43rd Annual Convention of the American Electroplating Society (1956) p. 26.
B. D. Dunn, ESA Sci. Technol. Rev. 2 (1976) 1.
M. O. Peach, J. Appl. Phys. 23 (1952) 1401.
K. C. Frank, Phil. Mag. 44 (1953) 854.
J. D. Eshlby, Phys. Rev. 91 (1953) 755.
S. Amelinckx, W. Bontinck, W. Dekeyser and F. Seitz, Phil. Mag. 2 (1957) 355.
W. C. Ellis, D. F. Gibbons and R. G. Treuting, “Growth and Perfection of Crystals” (John Wiley and Sons Inc., New York and Chichester, 1957) p. 102.
N. Furuta and K. Hamamura, Jap. J. Appl. Phys. 8 (1969) 1404.
U. Lindborg, B. Asthner, L. Lind and B. B. Revay, IEEE Trans. PHP 12 (1976) 33.
R. Kawanaka and S. Nango, Private Communication (1981).
K. N. Tu, Acta Met. 21 (1973) 347.
K. Fujiwara, M. Ohtani, T. Isu, S. Nango, R. Kawanaka and K. Shimizu, Thin Solid Films 70 (1980) 153.
T. Hasegawa and Y. Murata, Private Communication (1981).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Kakeshita, T., Shimizu, K., Kawanaka, R. et al. Grain size effect of electro-plated tin coatings on whisker growth. J Mater Sci 17, 2560–2566 (1982). https://doi.org/10.1007/BF00543888
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF00543888