Abstract
The electrical resistivity and equation of state of liquid copper and aluminum have been measured to temperatures of 4500 and 4000 K, respectively, using the isobaric expansion apparatus. The specific heats for the liquid are in good agreement with extrapolation of the 1973 Hultgren tables. The electrical resistivities are presented both with and without correction for thermal expansion. Both resistivity and thermal expansion results for aluminum are compared with the predictions of pseudopotential calculations. The specific volumes observed for both metals are less than those reported in the literature, apparently because of axial hydrodynamic displacement. In addition, sudden rapid acceleration in sample growth rate with a corresponding rapid rise in resistivity were observed.
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Gathers, G.R. Thermophysical properties of liquid copper and aluminum. Int J Thermophys 4, 209–226 (1983). https://doi.org/10.1007/BF00502353
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DOI: https://doi.org/10.1007/BF00502353