Abstract
The densification kinetics of 0.99 SnO2-0.01 CuO molar mixtures have been studied between 850 and 1150 °C. Both experimental analyses and theoretical modelling show the role of a liquid phase for sintering temperatures T s ≥ 940 °C: sintering is controlled by a liquid phase after a fast shrinkage due to grain rearrangement. The analytical formulation of the shrinkage behaviour suggests that dissolution at the solid-liquid interface is the limiting process when T s ≤ 1000 °C and diffusion is the limiting step at higher temperatures.
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Dolet, N., Heintz, J.M., Rabardel, L. et al. Sintering mechanisms of 0.99 SnO2-0.01 CuO mixtures. JOURNAL OF MATERIALS SCIENCE 30, 365–368 (1995). https://doi.org/10.1007/BF00354397
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DOI: https://doi.org/10.1007/BF00354397