Journal
Discover Polymers
Discover Polymers is an open access journal publishing research across the full range of polymer science, polymer processing, engineering and its applications.
Polymer-matrix composites attract global interest due to their advantages of easy processing, low manufacturing costs, flexibility, low dielectric constants, high breakdown strength, etc., in application fields such as electrostatic energy storage, underfills for packages, etc. In recent years, the study of polymers and their composites has drawn great interest in these fields. Polymer-matrix composites filled with inorganic fillers including SiO2 and Al2O3 have greatly improved several significant material parameters, including energy storage density, energy loss, dielectric breakdown strength, low viscosity and low coefficient of thermal expansion (CTE) of materials. On the other hand, issues regarding polymer-based composites have also been raised, which include interfacial defects, breakdown strength decreasing, novel applications, etc. Therefore, both opportunities and challenges are faced by researchers in these fields. Recognizing the significance of experiments and simulations in understanding the properties and novel applications of polymer-matrix composites/nanocomposites across scales and under a variety of conditions, this topical collection invites contributions covering several aspects of polymer/inorganic composites, such as dielectric nanocomposites for energy storage, polymer composites for fulfilling encapusulation, underfill and polymers for packaging substates, etc.
Keywords: Composites, nanocomposites, filler, interface, function, electric properties, thermodynamic properties
Submit your manuscript to this collection through the participating journal.
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Gang Jian
Gang Jian, PhD, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China. Gang Jian got his B.S. and PhD degrees from Huazhong University of Science and Technology in 2007 and 2011, respectively. He was a visiting scholar at Georgia Institute of Technology from 2017 to 2018. He is now an associate professor at Shenzhen Institute of Advanced Technology. His research fields lie in electronic functional composite materials, especially in the reliability and nanoparticle synthesis of multi-layer chip capacitors, as well as the material and process studies of flip-chip and fanout integrated circuit packaging structures.
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