Abstract
Wafer bonding is the stacking and joining of semiconductor substrates and is an essential process step in the development and production of MEMS (micro-electrical-mechanical systems) [1]. It provides the possibility to realize real three-dimensional structures, in this technology field where 2D-strutures with fixed thickness are still dominating. Actually nano- and micro mechanical and electrical elements are required and possible to be bonded at wafer level, this finally allows system integration across functional and geometrical domains.
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Knechtel, R., Schwarz, U. (2021). Wafer Bonding in MEMS Technologies. In: Zentner, L., Strehle, S. (eds) Microactuators, Microsensors and Micromechanisms. MAMM 2020. Mechanisms and Machine Science, vol 96. Springer, Cham. https://doi.org/10.1007/978-3-030-61652-6_8
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DOI: https://doi.org/10.1007/978-3-030-61652-6_8
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