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Oxidation of Solder Coatings

  • Chapter
The Mechanics of Solder Alloy Wetting and Spreading

Abstract

Solder coatings are widely used to protect copper printed wiring board (PWB) circuitry and electronic component leads from oxidation that can lead to loss of solderability. The coating is usually eutectic Sn-Pb that is either applied directly by hot dipping or electroplated and then densified by reflowing (melting). Numerous studies and ample practical experience have shown that, when properly applied and sufficiently thick, such coatings remain solderable even after several years of normal storage. In practice, however, the coating composition/morphology and storage conditions may not be optimum, allowing solderability degradation to occur. In addition, molten solder tends to flow away from curved areas in the substrate, resulting in localized thinning during solder dipping or reflow. Exposure of the underlying Cu-Sn intermetallic layer in the thinned region can lead to loss of solderability. Thinned solder is a particular problem at PWB through-hole rims and is commonly referred to as “weak knees.”

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References

  1. Ackroyd, M. L. 1976. Proc. INTERNEPCON 1976. Oct. 1976. p. 214.

    Google Scholar 

  2. Ackroyd, M. L., C. A. MacKay, and C. J. Thwaites. 1975. Met. Technol. 2(pt.2):73.

    Google Scholar 

  3. Ammar, I. A., S. Darwish, M. W. Khalil, and A. Galal. 1983. Z. Werkstofftech. 14:330.

    Article  Google Scholar 

  4. Ammar, I. A., S. Darwish, M. W. Khalil, and A. Galal. 1985. Z. Werkstofftech. 16:194.

    Article  Google Scholar 

  5. Ammar, I. A., S. Darwish, M. W. Khalil, and A. Galal. 1988. Mat.-wiss. u. Werkstofftech. 19:294.

    Article  Google Scholar 

  6. Ammar, I. A., S. Darwish, M. W. Khalil, and S. El-Taher. 1988. Mat.-wiss. u. Werkstofftech. 19:271.

    Article  Google Scholar 

  7. Ammar, I. A., S. Darwish, M. W. Khalil, and S. El-Taher. 1990. Corros. J. 46:197.

    Article  Google Scholar 

  8. Ansell, R. O., T. Dickinson, A. F. Povey, and P. M. A. Sherwood. 1977. J. Electrochem. Soc. 124:1360.

    Article  Google Scholar 

  9. Bader, W. G., and R. G. Baker. 1973. Plating. March 1973. p. 242.

    Google Scholar 

  10. Bernier, D. 1974. Plating. 61(9):842.

    Google Scholar 

  11. Bevolo, A. J., J. D. Verhoeven, and M. Noack. 1983. Surf. Sci. 134:499.

    Article  Google Scholar 

  12. Billot, M., and S. Clement. 1981. Tin and Its Uses. 131:1.

    Google Scholar 

  13. Bird, R. J. 1973. Met. Sci. J. 7:109.

    MathSciNet  Google Scholar 

  14. Boggs, W. E., P. S. Trozzo, and G. E. Pellisier. 1961. J. Electrochem. Soc. 108:13.

    Article  Google Scholar 

  15. Boggs, W. E., R. H. Kachik, and G. E. Pellisier. 1963. J. Electrochem. Soc. 110:4.

    Article  Google Scholar 

  16. Bowlby, R. 1987. Circuits Manufacturing. Nov. 1987. p. 76.

    Google Scholar 

  17. Boyer, A. P. 1979. Electron Packaging Prod. Oct 1979. p. 48.

    Google Scholar 

  18. Britton, S. C., and K. Bright. 1957. Metallurgia. 56:163.

    Google Scholar 

  19. Britton, S. C, and J. C. Sherlock. 1974. Br. Corros. J. 9:96.

    Article  Google Scholar 

  20. Burleigh, T. D., and H. Genscher. 1988. J. Electrochem. Soc. 135:2938.

    Article  Google Scholar 

  21. Costello, B. J. 1978. Electron. Packaging. Prod. July 1978. p. 64.

    Google Scholar 

  22. Davies, D. E., and S. N. Shah. 1963. Electrochim. Acta 8:703.

    Article  Google Scholar 

  23. Davis, P. E. 1971. Plating. 58(7):694.

    Google Scholar 

  24. Davis, P. E., M. E. Warwick, and P. J. Kay. 1982. Plating Surf. Fin. 69(9):72.

    Google Scholar 

  25. Davis, P. E., M. E. Warwick, and S. J. Muckett. 1983. Plating Surf. Fin. 70(8):49.

    Google Scholar 

  26. Davis, P. E., M. E. Warwick, and S. J. Muckett. 1964. GE Tech Information Series. General Electric Company. Report No. R64ELS-44. May 1964.

    Google Scholar 

  27. Di Giacomo, G. 1986. Proc. Int. Symp. Microelectronics. Atlanta, GA. p. 322.

    Google Scholar 

  28. Do Duc, H., and P. Tissot. 1979. Corros. Sci. 19:179.

    Article  Google Scholar 

  29. Drowgowska, M., H. Ménard, and L. Brossard. 1991. J. Appl. Electrochem. 21:84.

    Article  Google Scholar 

  30. Dunn, B. D. 1980. Trans. Inst. Met. Finish. 58:26.

    Google Scholar 

  31. Edington, R. J., and L. A. Lawrence. 1988. Printed Circuit Assembly. 2(6): 13.

    Google Scholar 

  32. Eishon, G., and S. M. Bobbio. 1990. “Fluxless Soldering Process.” U. S. Patent No. 4,921,157. Issued 1 May 1990.

    Google Scholar 

  33. El Wakkad, S. E. S., A. M. Shams El Din, and J. A. El Sayed. 1954. J. Chem. Soc. (London). p. 3103.

    Google Scholar 

  34. Farrell, T. 1976. Met. Sci. March 1976. p. 87.

    Google Scholar 

  35. Fidos, H., and K. Piekarski. 1973. Inst. Metals. 101:95.

    Google Scholar 

  36. Frankenthal, R. P., and D. J. Siconolfi. 1980. J. Vac. Sci. Technol. 17:1315.

    Article  Google Scholar 

  37. Frankenthal, R. P., and D. J. Siconolfi. 1981. Surf. Sci. 104:205.

    Article  Google Scholar 

  38. Frear, D., D. Grivas, and J. W. Morris Jr. 1988. J. Electron. Mater. 17(2):171.

    Article  Google Scholar 

  39. Gabe, D. R. 1977. Surf. Technol. 5:463.

    Article  Google Scholar 

  40. Geiger, A. L. 1986. Proc. 10th Annual Soldering/Manufacturing Seminar. Naval Weapons Center, China Lake. NWC TP 6707. p. 111.

    Google Scholar 

  41. Geist, H. E. 1983. Electrochem. Soc. Extended Absts. 83(2):314.

    Google Scholar 

  42. Geist, H., and M. Kottke. 1986. Proc. 36th IEEE Electronic Conf. p. 636.

    Google Scholar 

  43. Giannetti, B. F., P. T. A. Sumodjo, and T. Rabockai. 1990. J. Appl. Electrochem. 20:672.

    Article  Google Scholar 

  44. Hagge, J. K., and G. J. Davis. 1985. Circuit World. 11(3):8.

    Article  Google Scholar 

  45. Hampson, N. A., and N. E. Spencer. 1968. Br. Corros. J. 3:1.

    Article  Google Scholar 

  46. House, C. I., and G. H. Kelsall. 1984. Electrochem. Acta. 29:1439.

    Article  Google Scholar 

  47. IPC/EIA Steam Aging Task Group Report. April 1992.

    Google Scholar 

  48. Kapusta, S. D., and N. Hackerman. 1980. Electrochim. Acta. 25:1625.

    Article  Google Scholar 

  49. Kay, P. J. 1981. The Joining of Metals: Practice and Performance. vol. 2. London, U.K.: Inst. of Metallurgists. p. 131.

    Google Scholar 

  50. Kay, P. J., and C. A. MacKay. 1976. Trans. Inst. Met. Finish. 54:68.

    Google Scholar 

  51. Kay, P. J., and C. A. MacKay. 1979. Trans. Inst. Met. Finish. 57:169.

    Google Scholar 

  52. Klein-Wassink, R. J. 1989. Soldering in Electronics. Ayr, Scotland: Electrochemical Publications, Ltd.

    Google Scholar 

  53. Konetzki, R.A., Y. A. Chang, and V. C. Marcotte. 1989. J. Mater. Res. 4:1421.

    Article  Google Scholar 

  54. Konetzki, R. P., and Y. A. Chang. 1988. J. Mater. Res. 3:466.

    Article  Google Scholar 

  55. Konetzki, R. P., M. X. Zhang, D. A. Sluzewski, and Y. A. Chang. 1990. J. Electron. Packaging. 112:175

    Article  Google Scholar 

  56. Kumar, K., and A. Moscaritolo. 1981. J. Electrochem. Soc. 128(2):379.

    Article  Google Scholar 

  57. Kurz, R., and E. Kleiner. 1971. Z. f. Werkstofftechnik/J. Mater. Technol. 2:418.

    Google Scholar 

  58. Lampe, B. T. 1976. Welding Res. Suppl. 330-s.

    Google Scholar 

  59. Le Fevre, B. G., and R. A. Barczykowski. 1985. Wire J. Int. 18(1):66.

    Google Scholar 

  60. Lea, C. 1986. DVS. 104:180.

    Google Scholar 

  61. Lea, C. 1991. Soldering Surf. Mount Technol. 7:10

    Article  Google Scholar 

  62. Lea, C. 1991. Soldering Surf. Mount Technol. 8:4.

    Article  Google Scholar 

  63. Lin, A. W. C., N. R. Armstrong, T. Kuwana. 1977. Anal. Chem. 49:1228.

    Google Scholar 

  64. Luner, C. 1960. Trans. Metallur. Soc. AIME. 218:572.

    Google Scholar 

  65. MacKay, C. A. 1979. Welding Met. Fab. Jan/Feb. 1979. p. 53.

    Google Scholar 

  66. Electronics. April 1983. p. 41.

    Google Scholar 

  67. Mather, J. C. 1984. PC Fab. April 1984. p. 34.

    Google Scholar 

  68. McCarthy, T. J., C. A. MacKay, and C. J. Thwaites. 1980. Circuit World. 6(4):6.

    Article  Google Scholar 

  69. Mei, S., H. B. Huntington, C. K. Hu, and M. J. McBride. 1987. Scripta Metal. 21:153.

    Article  Google Scholar 

  70. Miller, R. G., and C. Q. Bowles. 1990. Oxid. Metals. 33:95.

    Article  Google Scholar 

  71. Nagasaka, M., H. Fuse, and T. Yamashina. 1975. Thin Solid Films. 29:L29.

    Article  Google Scholar 

  72. Nagel, V. 1985. ZIS-Mitteilungen. 27:440.

    Google Scholar 

  73. Orchard, S. W., R. L. Paul, and J. E. C. Timm. 1982. S. Afr. J. Chem. 35(4):161.

    Google Scholar 

  74. Penzek, E. S. 1977. NEPCON Proc. March & May 1977.

    Google Scholar 

  75. Pourbaix, M. 1974. Atlas of Electrochemical Equilibria in Agueous Solutions. 2nd ed. NACE (Cebelcor). Houston, TX. (Brussels).

    Google Scholar 

  76. Powell, R. A. 1979. Appl. Surf. Sci. 2:397.

    Article  Google Scholar 

  77. Pugh, M., L. M. Warner, and D. R. Gabe. 1967. Corros. Sci. 7:807.

    Article  Google Scholar 

  78. Reed, J. R., N. E. Thompson, and R. K. Pond. 1991. IPC Tech. Review. June 1991. p. 16.

    Google Scholar 

  79. Russel, W. R., B. M. Waller, P. S. Barry, and W. M. Wolverton. 1989. Soldering Surf. Mount. Technol. Oct. 1989. p. 25.

    Google Scholar 

  80. Shah, S. N., and D. E. Davies. 1963. Electromchim. Acta. 8:663.

    Article  Google Scholar 

  81. Shams El Din, A. M., and F. M. Abd El Wahab. 1964. Electrochim. Acta. 9:883.

    Article  Google Scholar 

  82. Simic, V., and Z. Marinkovic. 1980. J. Less Common Met. 72:133.

    Article  Google Scholar 

  83. Spiliotis, N. J. 1978. Insulation/Circuits. June 1978. p. 33.

    Google Scholar 

  84. Starke, E., and H. Wever. 1964. Z. Metallkde. 55(3): 107.

    Google Scholar 

  85. Steen, H. A. H., and G. Becker. 1986. Brazing and Soldering. 11:4.

    Google Scholar 

  86. Steen, H. A. H., and A. Bengston. 1987. Brazing and Soldering. 13:28.

    Google Scholar 

  87. Stirrup, B. N., and N. A. Hampson. 1976. J. Electroanal. Chem. 67:45

    Article  Google Scholar 

  88. Stirrup, B. N., and N. A. Hampson. 1976. J. Electroanal. Chem. 73:189.

    Article  Google Scholar 

  89. Stoneman, A. M., and C. A. MacKay. 1977. Proc. INTERNEPCON. Oct. 1977. p. 49.

    Google Scholar 

  90. Tench, D. M., and D. P. Anderson. 1990. Plating Surf. Finish. 77(8):44; U. S. Patent pending (filed 28 May 1991).

    Google Scholar 

  91. Tench, D. M., and D. P. Anderson. 1992. “Method of Restoring Solderability.” U. S. Patent No. 5,104,494. Issued 14 April 1992.

    Google Scholar 

  92. Tench, D. M., and D. P. Anderson. 1993. “Roughened Substrate for Uniform Solder Coating.” U. S. Patent No. 5,178,965. Issued 12 Jan. 1993.

    Google Scholar 

  93. Tench, D. M., M. W. Kendig, D. P. Anderson, D. D. Hillman, G. K. Lucey, and T.J. Gher. (a) (in press). “Production Validation of SERA Solderability Testing.” Soldering Surf. Mount Technol.

    Google Scholar 

  94. Tench, D. M., D. P. Anderson, and P. Kim. (b). “Solderability Assessment via Sequential Electrochemical Reduction Analysis,” submitted to J. Appl. Electrochem.

    Google Scholar 

  95. Samsonov, G. V., ed. 1973. The Oxide Handbook. New York: IFI/Plenum. p. 263.

    Book  Google Scholar 

  96. Thwaites, C. J. 1959. Trans. Inst. Met. Finish. 36:203.

    Google Scholar 

  97. Thwaites, C. J. 1965. Trans. Inst. Met. Finish. 43:143.

    Google Scholar 

  98. Thwaites, C. J. 1972. Welding J. Oct. 1972. p. 702.

    Google Scholar 

  99. Unsworth, D. A., and C. A. MacKay. 1973. Trans. Inst. Met. Finish. 51:85.

    Google Scholar 

  100. Varsányi, M. L., J. Jaén, A. Vértes, and L. Kiss. 1985 Electrochim. Acta. 30:529.

    Article  Google Scholar 

  101. Vértes, A., H. Leidheier Jr., M. L. Varsányi, G. W. Simmons, and L. Kiss. 1978. J. Electrochem. Soc. 125:1946.

    Article  Google Scholar 

  102. Wild, R. N. 1985. Brazing and Soldering. 9:5.

    Google Scholar 

  103. Wild, R. N. 1987. Brazing and Soldering. 13:42.

    Google Scholar 

  104. Wilson, G. C. 1977. New Electronics. 10(6):99.

    Google Scholar 

  105. Wilson, G. C. 1978. Circuit World. 4(3):39.

    Article  Google Scholar 

  106. YiYu, Q., F. Hongyuan, C. Dinghua, F. Fuhua, and H. Lixia. 1987. Brazing and Soldering. 13:39.

    Google Scholar 

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  1. Rockwell International Science Center, 1049 Camino Dos Rios, Thousand Oaks, CA, 91358, USA

    D. Morgan Tench

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  1. D. Morgan Tench
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Editors and Affiliations

  1. Sandia National Laboratories, Department 1831, Center for Solder Science & Technology, P.O. Box 5800, 87185, Albuquerque, NM, USA

    F. G. Yost  & F. M. Hosking  & 

  2. Sandia National Laboratories, Department 1832, Center for Solder Science & Technology, P.O. Box 5800, Albuquerque, NM, USA

    D. R. Frear

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© 1993 Van Nostrand Reinhold

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Tench, D.M. (1993). Oxidation of Solder Coatings. In: Yost, F.G., Hosking, F.M., Frear, D.R. (eds) The Mechanics of Solder Alloy Wetting and Spreading. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-1440-0_6

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  • DOI: https://doi.org/10.1007/978-1-4684-1440-0_6

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