Abstract
Despite its apparent simplicity, the spreading of molten solder on copper or on solder-coated copper to form a solder joint involves many complex physical processes. Poor solderability of electronic components, while infrequent in absolute numbers, can cause significant manufacturing difficulties when acceptable performance requires less than one failure in 106 joints. An assessment of solderability involves consideration of the entire soldering process including the details of the soldering equipment, the design of the joint geometry, and the wettability of the surfaces to be joined. Wettability involves consideration of the intrinsic rate and extent that solder can spread on a particular surface and is the primary focus of this chapter. Thus we need only consider macroscopically simple geometries of wetting; we will focus on the fundamental physical processes involved in solder wetting and spreading. The ultimate goal is to determine those processes that are most important in order to provide a scientific basis for the analysis of engineering problems in solder technology.
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Boettinger, W.J., Handwerker, C.A., Kattner, U.R. (1993). Reactive Wetting and Intermetallic Formation. In: Yost, F.G., Hosking, F.M., Frear, D.R. (eds) The Mechanics of Solder Alloy Wetting and Spreading. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-1440-0_4
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