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Solderability Testing

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The Mechanics of Solder Alloy Wetting and Spreading

Abstract

Solderability testing is used to predict the success of the soldering process before the large investment of assembly has taken place. Once several parts costing several hundreds of dollars or more are assembled and soldering is attempted, it is very expensive (and makes no sense) to discover that the unit will not function because one individual part did not solder. Hence, solderability testing is performed prior to assembly on the individual components to be joined to show the probability of soldering success.

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Author information

Authors and Affiliations

  1. Tin Research Institute, 1353 Perry Street, Columbus, Ohio, 43201, USA

    Bill Hampshire

  2. Texas Instruments, P.O. Box 655474, MS409, Dallas, TX, 75265, USA

    Mike Wolverton

Authors
  1. Bill Hampshire
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  2. Mike Wolverton
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Editor information

Editors and Affiliations

  1. Sandia National Laboratories, Department 1831, Center for Solder Science & Technology, P.O. Box 5800, 87185, Albuquerque, NM, USA

    F. G. Yost  & F. M. Hosking  & 

  2. Sandia National Laboratories, Department 1832, Center for Solder Science & Technology, P.O. Box 5800, Albuquerque, NM, USA

    D. R. Frear

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© 1993 Van Nostrand Reinhold

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Hampshire, B., Wolverton, M. (1993). Solderability Testing. In: Yost, F.G., Hosking, F.M., Frear, D.R. (eds) The Mechanics of Solder Alloy Wetting and Spreading. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-1440-0_2

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  • DOI: https://doi.org/10.1007/978-1-4684-1440-0_2

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-1442-4

  • Online ISBN: 978-1-4684-1440-0

  • eBook Packages: Springer Book Archive

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