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Control of Thermal Contact Conductance Using Interstitial Materials

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Thermal Contact Conductance

Part of the book series: Mechanical Engineering Series ((MES))

Abstract

As noted in Chapter 1, the actual solid-to-solid contact area, in most mechanical joints, is only a small fraction of the apparent area. The voids between the actual contact spots are usually occupied by some conducting substance such as air. Other interstitial materials may be deliberately introduced to control, that is, either to enhance or lessen, the thermal contact conductance: examples include foils, powders, wire screens, and epoxies. To enhance the conductance, the bare metal surfaces may also be coated with metals of higher thermal conductivity by electroplating or vacuum deposition. Greases and other lubricants also provide alternative means of enhancing thermal conductance of a joint.

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Authors and Affiliations

  1. School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW, 2052, Australia

    C. V. Madhusudana

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  1. C. V. Madhusudana
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© 1996 Springer-Verlag New York Inc.

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Madhusudana, C.V. (1996). Control of Thermal Contact Conductance Using Interstitial Materials. In: Thermal Contact Conductance. Mechanical Engineering Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4612-3978-9_6

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  • DOI: https://doi.org/10.1007/978-1-4612-3978-9_6

  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4612-8457-4

  • Online ISBN: 978-1-4612-3978-9

  • eBook Packages: Springer Book Archive

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