Abstract
Microelectronics packaging has been developing rapidly over the past ten years due to the demands for faster, lighter and smaller products. Printed circuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved developing of the structural integrity models for predicting lifetime under thermal environmental exposure; however the theoretical models need verification by the experiment.
The objective of the current application is the development of an optical system and testing procedure for evaluation of the thermal deformation of PCBs using moire interferometry. Due to the special requirements of the specimen and test condition, the existing technologies and setups were updated and modified. The discussions on optical methods, thermal loading chambers, and image data processing are presented. The proposed technique and specially designed test bench were employed successfully to measure the thermal deformations of PCB in the temperature range of −40°C to +160°C. The video-based moiré interferometry was used for generating, capturing and analysis of the fringe patterns. The obtained information yields the needed coefficients of thermal expansion (CTE) for tested printed circuit boards.
Access provided by Autonomous University of Puebla. Download to read the full chapter text
Chapter PDF
Similar content being viewed by others
Keywords
- Print Circuit Board
- Fringe Pattern
- Electronic Speckle Pattern Interferometry
- Moire Pattern
- Ball Grid Array Package
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
References
Y. Wang and P. Hassell, Measurement of thermally induced warpage of BGA packages/substrates using phase-stepping shadow moiré, Proc. of the 1st Electronic Technology Conference, 1997, pp. 283–289.
K. Verma, D. Columbus, B. Han, and B. Chandran, Real-time warpage measurement of electronic components with variable sensitivity, 1998 Electronic Components and Technology Conference, 1998, pp. 975–980.
P.B. Hassell, Advanced warpage characterization: location and type of displacement can be equally as important as magnitude, Proc. of Pan Pacific Microelectronics Symposium Conference, Feb. 2001.
S. Dilhaire, T. Phan, E. Schaub, and W. Claeys, High sensitivity and high resolution differential interferometer: micrometric polariscope for thermomechanical studies in microelectronics, Microelectronics Reliability, 37(10/11), pp. 1587–1590 (1997).
C.W. Tsai, C.H. Lee, and J. Wang, Deconvolution of local surface response from topography in nanometer profilometry with a dual-scan method, Optics Letters, 24(23), pp. 1732–1734 (1999).
K. Verma, D. Columbus, and B. Han, Development of real time/variable sensitivity warpage measurement technique and its application to plastic ball grid array package, IEEE Transactions on Electronics Packaging Manufacturing, 22(1), pp. 63–70 (1999).
T. Ahrens and M. Krumm, Deformation measurement at components, printed wiring boards and microelectronic assemblies to ensure the reliability of a system, Proceedings of EUPaC’96, 2nd European Conference on Electronic Packaging Technology, 1996, pp. 108–112.
K.-S. Kim, J.-H. Kim, J.-K. Lee, and S.-S. Jarng, Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature, Journal of Materials Science Letters, 16(21), pp. 1753–1756 (1997).
Y.C. Chan and F. Yeung, Nondestructive detection of defects in miniaturized multilayer ceramic capacitors using digital speckle correlation techniques, IEEE Transactions on Components, Packaging, and Manufacturing, Part A, 18(3), pp. 677–684 (1995).
H. Lu, C. Yeh, and K. Wyatt, Experimental evaluation of solder joint thermal strain in a CSP using digital speckle correlation, 1998 InterSociety Conference on Thermal Phenomena, 1998, pp. 241–245.
D. Post, B. Han, and P. Ifju, High Sensitivity Moire, Spring-Verlag, New York, 1994.
T. Ratanawilai, B. Hunter, G. Subbarayan, and D. Rose, A comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages, 2000 InterSociety Conference on Thermal Phenomena, 2000, pp. 246–252.
A.F. Bastawros and A.S. Voloshin, Transient thermal strain measurements in electronic packages, IEEE Transactions on Components, Hybrids and Manufacturing Technology, 13(4), pp. 961–966 (1990).
B. Han, Z. Wu, and S. Cho, Measurement of thermal expansion coefficient of flexible substrate by moire interferometry, Experimental Techniques, 25(3), pp. 22–25 (2001).
A.J. Durelli and W.F. Riley, Development in the grid method of experimental stress analysis, Proc. SESA, XIV(2), pp. 91–100 (1957).
A.S. Voloshin, C.P. Burger, R.E. Rowland, and T.S. Richard, Fractional moire strain analysis using digital imaging technique, Experimental Mechanics, 26, pp. 254–258 (1986).
C.A. Sciammarella, Basic optical law in the interpretation of moire pattern applied to the analysis of strain—Part I, Experimental Mechanics, 5, pp. 154–160 (1965).
A.F. Bastawros and A.S. Voloshin, Thermal strain measurements in electronic packages through fractional moiré interferometry, Journal of Electronic Packaging, 112, pp. 303–308 (1990).
K. Kato, F. Yamato, T. Murota, and T. Jimma, Improvement on method of measuring strain using interference fringes of diffracted beams at gratings on specimens, Bull. JSME, 16(100), pp. 1513–1523 (1973).
D. Post and W.A. Baracat, High sensitivity moire interferometry—a simplified approach, Experimental Mechanics, 21(3), pp. 100–104 (1981).
A.S. Voloshin, P.H. Tsao, and R.A. Pearson, In situ evaluation of residual stresses in an organic die-attach adhesive, Journal of Electronic Packaging, 120(3), pp. 314–318 (1998).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2007 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Voloshin, A. (2007). Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_13
Download citation
DOI: https://doi.org/10.1007/0-387-32989-7_13
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-27974-9
Online ISBN: 978-0-387-32989-5
eBook Packages: EngineeringEngineering (R0)