Abstract
System requirements for laser micro-machining strongly depends on the material to be processed. Since only one single laser type cannot serve to fulfill all requirements, each application asks for a well-considered system choice and a specific process optimization. This paper presents the possibilities and limitations concerning precision laser machining of different materials such as glass, ceramics, semiconductors and metals using 157 nm, 193 nm and 248 nm excimer as well as 780 nm Ti:sapphire femtosecond laser radiation.
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References
M. Fiebig, J. Fair, M. Scaggs et al.: “Micromachining with 157 nm laser radiation”, Conference Proceedings Euspen 99, Vol. 2, 31 May–4 June 1999, Bremen, pp. 96–99
H. K. Tönshoff, F. von Alvensleben, M. Rinke et al.: “Machining Concepts for Three-Dimensional Micro-Structuring with Pulsed UV-Lasers”, Proceedings of MicroEngineering, 29 September–1 October, 1999, Stuttgart
H. K. Tönshoff, F. von Alvensleben, C. Kulik: “Advanced 3D-CAD-Interface for Micromachining with Excimer Lasers”, Proceedings of SPIE Vol. 3680, Design, Test and Microfabrication of MEMS and MOEMS, 1999, Paris, pp. 340–348
Gower, M.C.: “Laser applications in microelectronik and optoelektronik manufacturing IV. Excimer laser micromachining: a 15 year perspective”. SPIE: Part of the SPIE Conference on Laser Applications in Microelectronik and Optoelectronik Manufacturing IV, Volume 3618, 25.–27.January 1999, San Jose, California. Washington: Society of Photo-Optical Instrumentation Engineers. — ISBN 0277-786X, pp. 251–260
B.N. Chichkov, C. Momma, S. Nolte, F. von Alvensleben, A. Tünnermann: “Femtosecond, picosecond and nanosecond laser ablation of solids”, Appl. Phys. A 63, 1996, pp. 109–115
C. Momma, B.N. Chichkov, S. Nolte, F. von Alvensleben, A. Tünnermann, H. Welling, B. Wellegehausen: “Short-pulse laser ablation of solid targets”, Opt. Commun.. 129, 1996, pp. 134–142
H.K. Tönshoff, C. Momma, A. Ostendorf, S. Nolte, G. Kamlage: “Microdrilling of Metals with Ultrashort Laser Pulses”, ICALEO 1998, Proceedings, Florida, p. A28
F. Korte, S. Nolte, B. N. Chichkov, T. Bauer, G. Kamlage, T. Wagner, C. Fallnich, H. Welling: “Far-field and Near-field Material Processing with Femtosecond Laser Pulses”, Appl. Phys. A 69,1999, pp. 7–11
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© 2002 Kluwer Academic Publishers
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Tönshoff, H.K., Ostendorf, A., Körber, K., Kulik, C., Kamlage, G. (2002). Micro Material Processing Using UV Laser and Femtosecond Laser. In: Inasaki, I. (eds) Initiatives of Precision Engineering at the Beginning of a Millennium. Springer, Boston, MA. https://doi.org/10.1007/0-306-47000-4_11
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DOI: https://doi.org/10.1007/0-306-47000-4_11
Publisher Name: Springer, Boston, MA
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