Abstract
CoWP films, used as a capping layer for a copper interconnection, were electrodeposited using alkali-metal-free precursors, and the effect of the electrolyte concentration on the film characteristics such as the thickness, composition, and microstructure was investigated. The current density and the film thickness increased with the concentration of cobalt, tungsten, and phosphorous precursors. When the cobalt ion concentration in the electrolyte was increased from 0.01 to 0.09M, the cobalt content in the film increased from 67 to 89 at%, while the tungsten and phosphorous contents decreased from 16 to 0.7 and 17 to 10 at%, respectively. The tungsten and phosphorous contents also increased as their corresponding concentrations increased in the electrolyte. Microstructural analyses showed that the tungsten and phosphorous content in the film greatly affected the crystallinity of the CoWP films electrodeposited using alkali-metal-free precursors.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
Refernces
V. M. Dubin, Y. Shacham-Diamand, B. Zhao, P. K. Vasudev and C. H. Ting, J. Electrochem. Soc., 144, 898 (1997).
P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans and H. Deligianni, IBM J. Res. Dev., 42 (1998).
Y. Shacham-Diamand, A. Dedhia, D. Hoffstetter and W. G. Oldham, J. Electrochem. Soc., 140, 2427 (1993).
N. Petrov, Y. Sverdlov and Y. Shacham-Diamand, J. Electrochem. Soc., 149, C187 (2002).
Y. Shacham-Diamand and S. Lopatin, Electrochim. Acta, 44, 3639 (1999).
H. Einati, V. Bogush, Y. Sverdlov, Y. Rosenberg and Y. Shacham-Diamand, Microelectron. Eng., 82, 623 (2005).
T. Osaka, N. Takano, T. Kurokawa and K. Ueno, Electrochem. Solid State Lett., 5, C7 (2002).
Y. Shacham-Diamand, J. Electron. Mater., 30, 336 (2001).
Shacham-Diamand, Y. Sverdlov and N. Petrov, J. Electrochem. Soc., 148, C162 (2001).
S. M. S. I. Dulal, H. J. Yun, C. B. Shin and C.-K. Kim, J. Electrochem. Soc., 154, D494 (2007).
S. M. S. I. Dulal, H. J. Yun, C. B. Shin and C.-K. Kim, Electrochim. Acta, 53, 934 (2007).
S. M. S. I. Dulal, T. H. Kim, C. B. Shin and C.-K. Kim, J. Alloy. Compd., 461, 382 (2008).
S. M. S. I. Dulal, H. J. Yun, C. B. Shin and C.-K. Kim, Appl. Surf. Sci., 255, 5795 (2009).
H. Nakano, T. Itabashi and H. Akahoshi, J. Electrochem. Soc., 152, C163 (2005).
T. Osaka, N. Takano, T. Kurokawa, T. Kaneko and K. Ueno, Surf. Coat. Technol., 169, 124 (2003).
E. J. O’sullivan, A. G. Schrott, M. Paunovic, C. J. Sambucetti, J. R. Marino, P. J. Bailey, S. Kaja and K. W. Semkow, IBM J. Res. Dev., 42, 607 (1998).
C. L. Siu, H. C. Man and C. H. Yeung, Surf. Coat. Technol., 200, 2223 (2005).
E. B. Deal, IEEE Trans. Electron. Devices, ED-27, 606 (1980).
J. Gambino, J. Wynne, J. Gill, S. Mongeon, D. Meatyard, B. Lee, H. Bamnolker, L. Hall, N. Li, M. Hernandez, P. Little, M. Hamed, I. Ivanov and C. L. Gan, Microelectron. Eng., 83, 2059 (2006).
S. Armyanov, E. Valova, A. Franquet, J. Dille, J.-L. Delplancke, A. Hubin, O. Steenhaut, D. Kovacheva, D. Tatchev and Ts. Vassilev, J. Electrochem. Soc., 152, C612 (2005).
A. Brenner, Electrodeposition of alloys: Principles and practices, Academic Press, New York (1963).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Namkoung, Y.M., Lee, HM., Son, YS. et al. Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors. Korean J. Chem. Eng. 27, 1596–1600 (2010). https://doi.org/10.1007/s11814-010-0235-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11814-010-0235-2