Abstract
In order to study the electromigration (EM) behavior of solder joints in electronics packaging, especially under high-current and high-temperature working conditions, line-type Cu/solder/Cu butting samples were prepared to observe the microstructural evolution under 1.0 × 104 A/cm2 current stressing. A prominent polarity effect was found such that the Cu6Sn5 intermetallic compound (IMC) layer at the anode side, which thickened linearly with time, was much thicker than that at the cathode side. Compared to the samples subjected to thermal aging at the same temperature of 180°C, EM enhanced the Cu3Sn growth at both the anode and the cathode. Two distinct types of damage were observed after extended duration of current stressing. Back-flow of Cu into Cu3Sn was found at the Cu3Sn/Cu6Sn5 interface of the anode side, causing large voids, while strip cracks developed at the cathode solder/Cu6Sn5 interface, causing a significant increase of joint electrical resistance. With the mass transport characteristics that determine the IMC growth and vacancy accumulation analyzed in detail at each interface, formation mechanisms of the two types of damages are discussed.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
B. Lee, J. Park, J. Song, K.-W. Kwon, and H.-J. Lee, J. Electron. Mater. 40, 324 (2010).
W. Zhang, Jpn. J. Appl. Phys. 54, 030203 (2015).
E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan, Appl. Phys. Lett. 80, 580 (2002).
K.N. Tu, Microelectron. Reliab. 51, 517 (2011).
B. Chao, S.-H. Chae, X. Zhang, K.-H. Lu, J. Im, and P.S. Ho, Acta Mater. 55, 2805 (2007).
Y.H. Lin, C.M. Tsai, Y.C. Hu, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 34, 27 (2005).
H. Hsu, T.-Y. Lin, and F.-Y. Ouyang, J. Electron. Mater. 43, 236 (2013).
Y.L. Lin, C.W. Chang, C.M. Tsai, C.W. Lee, and C.R. Kao, J. Electron. Mater. 35, 1010 (2006).
J.H. Ke, T.L. Yang, Y.S. Lai, and C.R. Kao, Acta Mater. 59, 2462 (2011).
J.H. Ke, H.Y. Chuang, W.L. Shih, and C.R. Kao, Acta Mater. 60, 2082 (2012).
T.L. Yang, J.H. Ke, W.L. Shih, Y.S. Lai, and C.R. Kao, J. Appl. Phys. 114, 053501 (2013).
Y. Yao, L.M. Keer, and M.E. Fine, J. Appl. Phys. 105, 063710 (2009).
L.D. Chen, M.L. Huang, and S.M. Zhou, J. Alloys Compd. 504, 535 (2010).
Y.T. Huang, C.H. Chen, B.H. Lee, H.C. Chen, C.M. Wang, and A.T. Wu, J. Electron. Mater. 45, 6163 (2016).
C.-E. Ho, P.-T. Lee, C.-N. Chen, and C.-H. Yang, J. Alloys Compd. 676, 361 (2016).
F.-Y. Ouyang, H. Hsu, Y.-P. Su, and T.-C. Chang, J. Appl. Phys. 112, 023505 (2012).
H. Gan and K.N. Tu, J. Appl. Phys. 97, 063514 (2005).
M.-H. Jeong, G.-T. Lim, B.-J. Kim, K.-W. Lee, J.-D. Kim, Y.-C. Joo, and Y.-B. Park, J. Electron. Mater. 39, 2368 (2010).
Y. Jung and J. Yu, J. Appl. Phys. 115, 083708 (2014).
K. Meier, M. Roellig, S. Wiese, and C. Goette, in International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. (Eurosime, 2007), pp. 1.
M.K. Rahman, A.M.M. Musa, B. Neher, K.A. Patwary, M.A. Rahman, and M.S. Islam, J. Electron. Cool. Therm. Control 06, 19 (2016).
L. Zhang, X.-Y. Fan, C.-W. He, and Y.-H. Guo, J. Mater. Sci. Mater. Electron. 24, 3249 (2013).
P.L. Tu, Y.C. Chan, K.C. Hung, and J.K.L. Lai, Scripta Mater. 44, 317 (2001).
Y. Yang, Y. Li, H. Lu, C. Yu, and J. Chen, Microelectron. Reliab. 53, 327 (2013).
Database for Solder Properties with Emphasis on New Lead-free Solders. (National Institute of Standards and Technology & Colorado School of Mines, 2002), https://www.metallurgy.nist.gov/solder/NIST_Leadfree Solder_v4.pdf. Accessed 31 May 2017.
L. Mo, Z. Chen, F. Wu, and C. Liu, Intermetallics 66, 13 (2015).
Y. Yang, H. Lu, C. Yu, and Y. Li, Microelectron. Reliab. 51, 2314 (2011).
B. Chao, S.-H. Chae, X. Zhang, K.-H. Lu, M. Ding, J. Im, and P.S. Ho, J. Appl. Phys. 100, 084909 (2006).
J. Zhang and G.Q. Zhang, Solid State Lighting Reliability Part 2: Components to Systems, ed. W.K.V. Driel, X. Fan, and G.Q. Zhang (Cham: Springer, 2018), p. 337.
C. Chen and S.W. Liang, J. Mater. Sci. Mater. Electron. 18, 259 (2007).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Chen, Z., Tian, W., Li, J. et al. Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing. J. Electron. Mater. 47, 2499–2506 (2018). https://doi.org/10.1007/s11664-017-6038-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-017-6038-z