The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint’s strength increases with decreasing joint volume \( \left( {V = {\frac{\pi }{4}}d^{2} t} \right), \) and the correlation follows an inverse proportional function reasonably well.
Article PDF
Avoid common mistakes on your manuscript.
References
J. Cugnoni, J. Botsis, and J. Janczak-Rusch, Adv. Engng. Mater. 8, 184 (2006).
Z.H. Huang, P.P. Conway, E. Jung, R.C. Thomson, C.Q. Liu, T. Loeher, and M. Minkus, J. Electron. Mater. 36, 1761 (2006).
P. Zimprich, A. Betzwar-Kotas, G. Khatibi, B. Weiss, and H. Ipser, J. Mater. Sci.: Mater. Electron. 19, 383 (2008).
F. Ren, J.W. Nah, K.N. Tu, B. Xiong, L. Xu, and J.H.L. Pang, Appl. Phys. Lett. 89, 141914 (2006).
W.J. Plumbridge, J. Mater. Sci. 31, 2501 (1996).
K.S. Kim, S.H. Huh, and K. Suganuma, Microelectron. Relia. 43, 259 (2003).
H.J. Saxton, A.J. West, and C.R. Barrett, Metall. Trans. 2, 999 (1971).
A.J. West, H.J. Saxton, A.S. Tetelman, and C.R. Barrett, Metall. Trans. 2, 1009 (1971).
T.H. Courtney, Mechanical Behavior of Materials, McGraw Hill, New York, 1990.
P.W. Bridgman, Studies in Large Plastic Flow and Fracture, Harvard University Press, Cambridge, 1964.
Acknowledgements
This research was supported by the Ministry of Education, China, through the NCET (04-0824) and its matching grant, and the Alexander von Humboldt Foundation through a grant of resumption of fellowship to XPZ (1037365). C.L. acknowledges support from the Curtin Internal Research Grant.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Yin, L., Zhang, X. & Lu, C. Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints. J. Electron. Mater. 38, 2179–2183 (2009). https://doi.org/10.1007/s11664-009-0858-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-009-0858-4