The growth behavior of the intermetallic compounds that formed at the interfaces between Sn-Ag-Bi-In solders and Cu substrates during solid-state aging is investigated. The compositions of the intermetallic compounds are Cu3(Sn,In) near the Cu substrates and Cu6(Sn,In)5 near the solders; very little Bi or Ag was dissolved in the compounds. The aging temperatures were 120°C, 150°C, and 180°C for 5 days, 10 days, 20 days, and 40 days. The change in the morphology of Cu6(Sn,In)5 from scallop type to layer type was prominent at the aging temperature of 180°C. The thickness of the compound layers did not vary much at the lower aging temperatures but followed the diffusion- controlled mechanism at 180°C. Massive Kirkendall voids were observed in Cu3(Sn,In) layers at the aging temperature of 180°C.
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Acknowledgements
The authors would like to thank the National Science Council of Taiwan for financially supporting this research under Contract No. NSC96-2221- E-008-124. Professor J.G. Duh and S.Y. Tsai of National Tsing Hua University are appreciated for supporting the EPMA operation, as well as Henkel-Accurus for kindly providing the Pb-free solders. Ted Knoy is appreciated for his editorial assistance.
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Wu, A.T., Chen, MH. & Siao, CN. The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates. J. Electron. Mater. 38, 252–256 (2009). https://doi.org/10.1007/s11664-008-0567-4
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DOI: https://doi.org/10.1007/s11664-008-0567-4