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The online version of the original article can be found at http://dx.doi.org/10.1007/s11664-005-0205-3
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Hwang, J.W., Yim, M.J. & Paik, K.W. Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly. J. Electron. Mater. 35, 189 (2006). https://doi.org/10.1007/s11664-006-0203-0
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DOI: https://doi.org/10.1007/s11664-006-0203-0