Abstract
The Sn-Co-Cu eutectic alloy can be a less expensive alternative for the Sn-Ag-Cu alloy. In order to find the eutectic solder composition of the Sn-Co-Cu system, the Sn-Co binary system has been thoroughly assessed with the calculation of phase diagram (CALPHAD) method. The liquid phase, the FCC and HCP Co-rich solid solution, and the BCT Sn-rich solid solution have been described by the Redlich-Kister model. The Hillert-Jarl-Inden model has been used to describe the magnetic contributions to Gibbs energy in FCC and HCP. The CoSn2, CoSn, Co3Sn2_β, and Co3Sn2_α phases have been treated as stoichiometric phases. A series of thermodynamic parameters have been obtained. The calculated phase diagram and thermodynamic properties are in good agreement with the experimental data. The obtained thermodynamic data was used to extrapolate the ternary Sn-Co-Cu phase diagram. The composition of the Sn-rich eutectic point of the Sn-Co-Cu system was found to be 224°C, 0.4% Co, and 0.7% Cu.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
L.B. Liu, C. Andersson, J. Liu, and Y.C. Chan, Interpack 2003-35126, Int. Electronic Packaging Technical Conf. Exhib. (New York: ASME, 2003), pp. 141–146.
J.H. Shim, C.S. Oh, B.J. Lee, and D.N. Lee, Z. Metallkd. 87, 205 (1996).
Q. Chen (Master’s thesis, Central South University of Technology, 1990).
K. Ishida and T. Nishizawa, J. Phase Equilibrium 12, 88 (1991).
H. Okamato, J. Phase Equilibrium 14, 3 (1993).
U. Hashimoto, J. Jpn. Inst. Met. 2, 67 (1938).
H. Comert and J.N. Pratt, Metall. Trans. A 23A, 2401 (1992).
K. Lewkonja, Z. Anorg. Allg. Chem. 59, 294 (1908).
S.F. Zemczuzny and S.W. Belynsky, Z. Anorg. Allg. Chem. 59, 364 (1908).
J.B. Darby, Jr. and D.B. Jugle, Trans. TMS-AIME 245, 2515 (1969).
H. Comert and J.N. Pratt, Thermochin. Acta 84, 273 (1985).
F. Korber and W. Oelson, Mitt. Kaiser-Wilhelm-Inst. Eisenforsh 19, 209 (1937).
Y.O. Esin, M.G. Valishev, V.M. Baev, and P.V. Gel’d, Russ. J. Phys. Chem. 51, 1479 (1977).
M.C. Heuzey and A.D. Pelton, Metall. Mater. Trans. 27, 810 (1996).
V.M. Eremenko, G.M. Lukashenko, and V.L. Pritula, Izv. Akd. Nauk SSSR, Met. 82 (1971).
B. Predel and W. Vogelbein, Thermochim. Acta 30, 201 (1979).
A.R. Miedema, R. Boom, and F.R. de Boer, J. Less-Common Met. 41, 283 (1975).
N.M. Matveyeva, S.V. Nikitina, and S.B. Zezin, Izv. Akad. Nauk SSSR, Met. 5, 194 (1968), in Russian; Russ. Metall. 5, 132 (1968).
A.T. Dinsdale, CALPHAD 15, 317 (1991).
O. Redlich and A.T. Kister, Ind. Eng. Chem. 24, 345 (1948).
M. Hillert and M. Jarl, CALPHAD 2, 227 (1978).
B. Sundman, B. Jansson, and J.O. Andersson, CALPHAD 9, 153 (1985).
Y.M. Muggianu, M. Gambino, and I.P. Bros, J. Chem. Phys. 72, 83 (1975).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Liu, L., Andersson, C. & Liu, J. Thermodynamic assessment of the Sn-Co lead-free solder system. J. Electron. Mater. 33, 935–939 (2004). https://doi.org/10.1007/s11664-004-0019-8
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-004-0019-8