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Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

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Abstract

The warpage of the package substrate mainly originates from the material property and size variations of individual components, especially when multiple components are involved. To maintain the substrate warpage within acceptable limits, it’s crucial to fine-tune component parameters carefully, choosing appropriate materials and processing conditions. The current study investigates the factors influencing substrate warpage and explores the methods to mitigate it with the assistance of finite element analysis. Glass fiber reinforced epoxy-based substrates were prepared under different curing temperatures, and characterized by thermo-mechanical analysis and mechanical testing. A finite element simulation model of the bare carrier board was developed using ABAQUS software. The results show that the curing temperature impacts the coefficient of thermal expansion (CTE), strength and modulus of the substrate. The differences in CTE and dimensional parameters among the component materials strongly influence substrate warpage. While the curing conditions affect bare carrier board warpage to some extent, the type and thickness of solder mask have more significant effects and warpage can be mitigated by properly choosing and applying solder masks.

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Acknowledgements

The authors sincerely acknowledge the Department of Science and Technology of Guangdong Province (Project No. 2023B0101020004), National Natural Science Foundation of China (NSFC, No. 62374080), and Shenzhen Key Laboratory of Intelligent Manufacturing for Continuous Carbon Fibre Reinforced Composites (Project No. ZDSYS20220527171404011) for the financial support.

Funding

This work was supported by Ministry of Industry and Information Technology of China, National Natural Science Foundation of China (NSFC, No. 62374080), and Shenzhen Key Laboratory of Intelligent Manufacturing for Continuous Carbon Fibre Reinforced Composites (Project No. ZDSYS20220527171404011).

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Authors and Affiliations

  1. Shenzhen Key Laboratory of Intelligent Manufacturing for Continuous Carbon Fiber Reinforced Composites, Southern University of Science and Technology, Shenzhen, 518055, China

    Guowei Fan, Zengming Hu, Jie Xu, Zeming Fang & Ke Wang

  2. School of System Design and Intelligent Manufacturing, Southern University of Science and Technology, Shenzhen, 518055, China

    Guowei Fan, Zengming Hu, Jie Xu, Zeming Fang & Ke Wang

  3. Guangdong Shengyi Technology Co., Ltd., Dongguan, 523000, China

    Junqi Tang, Li Luo & Qianfa Liu

  4. Division of Advanced Engineering Materials, Guangzhou HKUST Fok Ying Tung Research Institute, Guangzhou, 511458, China

    Dashun Liu

  5. The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, China

    Dong Lu & Ke Xue

Authors
  1. Guowei Fan
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  2. Zengming Hu
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  3. Jie Xu
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  7. Li Luo
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  11. Ke Wang
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Contributions

All authors contributed to the study conception and design. Guowei Fan: Material preparation, data collection and analysis, simulation, manuscript drafting and revision; Jie Xu, Junqi Tang, Zeming Fang, Li Luo and Qianfa Liu: Experiment design and execution, data analysis; Dashun Liu, Dong Lu and Ke Xue: Data validation, simulation, manuscript review; Ke Wang: Supervision, conceptualization, manuscript review and editing. All authors have read and approved the final manuscript.

Corresponding author

Correspondence to Ke Wang.

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Fan, G., Hu, Z., Xu, J. et al. Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study. J Mater Sci: Mater Electron 35, 1734 (2024). https://doi.org/10.1007/s10854-024-13499-z

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