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Undissolved gold in fine-pitch BGA solder joint under thermal cycling test

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Abstract

Crack propagation has been observed on the bulk solder area of the reworked fine-pitch ball grid array component with the solder joint type SAC305 (Sn97.18 Ag2.0 Cu0.75 Ni0.07) post 550 cycles thermal cycling test (TCT). Four variables were analyzed; control sample PT0, rework sample RT0, and two samples being exposed to the TCT at 550 cycles: sample without rework PT550 and sample with rework RT550. Nondestructive and destructive tests such as 3D X-ray, dye and pull test, cross-section, optical inspection, field emission scanning electron microscopy, and energy dispersive X-ray analysis (EDX) have been complemented with strain-energy density simulation results to further understand the symptoms. EDX analysis results show that up to 12.04 percent, by weight (wt%) gold content is present in the intermetallic compound particles along the crack propagation area in the bulk solder joint’s area due to the undissolved gold. Strain-energy density up to 3.04 Pa to the solder joints causing thermal fatigue crack as observed in the 3D X-ray, dye and pull test, and cross-section sample.

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Data availability

The data that support the findings of this study are available from Western Digital®, but restrictions apply to the availability of these data, which were used under license for the current study, and so are not publicly available. Data are, however, available from the authors upon reasonable request and with permission of Western Digital.

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Acknowledgements

The authors would like to acknowledge the financial support provided by Western Digital® via SanDisk Storage Malaysia Sdn. Bhd. through a research grant (RR-2020-004) and collaboration with the Universiti Kebangsaan Malaysia.

Funding

This work was funded by Western Digital® via SanDisk Storage Malaysia Sdn. Bhd., RR-2020-004, Azman Jalar.

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Authors and Affiliations

  1. Western Digital®, SanDisk Storage Malaysia Sdn.Bhd., Plot 301A, Persiaran Cassia Selatan 1, Taman Perindustrian Batu Kawan, MK13, Batu Kawan, 14100, Seberang Perai Selatan, Penang, Malaysia

    Adlil Aizat Ismail, Fakhrozi Che Ani, Zol Effendi Zolkefli & Erwan Basiron

  2. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia

    Adlil Aizat Ismail, Maria Abu Bakar & Azman Jalar

  3. Department of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia

    Azman Jalar

Authors
  1. Adlil Aizat Ismail
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  2. Maria Abu Bakar
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  3. Azman Jalar
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  4. Fakhrozi Che Ani
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  5. Zol Effendi Zolkefli
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  6. Erwan Basiron
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Contributions

A.I and Z.Z performed rework sample preparation, temperature measurements, 3D X-ray, cross-section samples, dye and pull test, FE-SEM, and EDX analysis. A.I performed the strain-energy density simulation analysis. Data validation and general recommendations were provided by E.B, F.C.A., and A.I. The first draft of the manuscript was written by A.I, and all authors commented on previous versions of the manuscript. Supervision, writing, review, editing, and funding acquisition were performed by M.A, A.J, and F.C.A. All authors read and approved the final manuscript. All authors contributed to the study's conception and design.

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Correspondence to Maria Abu Bakar.

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Ismail, A.A., Abu Bakar, M., Jalar, A. et al. Undissolved gold in fine-pitch BGA solder joint under thermal cycling test. J Mater Sci: Mater Electron 35, 866 (2024). https://doi.org/10.1007/s10854-024-12595-4

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  • DOI: https://doi.org/10.1007/s10854-024-12595-4

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